System and methods for automatic generation of component data

ABSTRACT

A method of manufacturing electronic circuits including generating CAD data, a bill of materials and an approved component vendor list for an electronic circuit and employing the CAD data, the bill of materials and the approved component vendor list for automatically generating a pick &amp; place machine-specific component loading specification, a pick &amp; place machine-specific component placement sequence and pick &amp; place machine-specific component data for governing the operation of at least one specific pick &amp; place machine in a manufacturing line.

FIELD OF THE INVENTION

The present invention relates to automated manufacture of electroniccircuits.

BACKGROUND OF THE INVENTION

The following patent documents are believed to represent the currentstate of the art:

U.S. Pat. Nos. 6,687,557 and 5,781,447; and

U.S. Patent Application Number: 2004/0089413

SUMMARY OF THE INVENTION

The present invention seeks to provide improved methods and systems forautomated manufacture of electronic circuits.

For the sake of clarity and conciseness, the following glossary ofdefined terms is employed throughout:

ACVL—Approved Component Vendor List

AMSSHP—Adaptive Machine Specific Shape Parameters

AMSSUP—Adaptive Machine Specific Supply Parameters

BOM—Bill of Materials

Cat#—Catalog Number

CCL—Compiled Component Library

CCSL—Compiled Component Supply Library

CPCA DATA—Combined Printed Circuit Assembly Data using PCN designations

CPL—Component Placement List

CSF—Component Supply Form

CV—Component Vendor

DCN—Designer Component Number

DCSF Parameters—Default Component Supply Form Parameters

GCG—Generic Component Geometric

MCVL—Master Component Vendor Library

MSSHP—Machine Specific Shape Parameters

MSSHPL—Machine Specific Shape Parameter Library

MSSUP—Machine Specific Supply Parameters

MSSUPL—Machine Specific Supply Parameter Library

MV—Machine Vendor

PCA—Printed Circuit Assembly

PCN—Programmer Component Number

UMCL—User Maintained Component Library

UMCSL—User Maintained Component Supply Library

There is thus provided in accordance with a preferred embodiment of thepresent invention a method of manufacturing electronic circuitsincluding generating CAD data, a bill of materials and an approvedcomponent vendor list for an electronic circuit and employing the CADdata, the bill of materials and the approved component vendor list forautomatically generating a pick & place machine-specific componentloading specification, a pick & place machine-specific componentplacement sequence and pick & place machine-specific component data forgoverning the operation of at least one specific pick & place machine ina manufacturing line.

In accordance with a preferred embodiment of the present invention theemploying the CAD data, the bill of materials and the approved componentvendor list for automatically generating pick & place machine specificcomponent data for governing the operation of at least one specific pick& place machine includes automatically generating the pick & placemachine-specific component data by employing a first database containingat least one of pick & place machine-independent, geometric componentdata and pick & place machine-independent, component supply data and asecond database containing machine-specific, componentmanufacturer-independent rules for generating the pick & placemachine-specific component data.

In accordance with another preferred embodiment of the present inventionthe pick & place machine specific component data for governing theoperation of at least one specific pick & place machine comprises atleast one of pick & place machine-specific component shape parametersand pick & place machine-specific component supply parameters.Preferably, the automatically generating pick & place machine-specificcomponent data includes automatically generating a third databasecontaining at least a mapping between component identifiers and pick &place machine-specific component shape parameters and a mapping betweenthe component identifiers and pick & place machine-specific componentsupply parameters.

In accordance with yet another preferred embodiment of the presentinvention the mapping between component identifiers and pick & placemachine-specific component shape parameters includes a mapping of PCNsto component shape identifiers and a mapping of component shapeidentifiers to pick & place machine-specific component shape parameters.Preferably, component shape identifiers are pick & placemachine-specific component shape identifiers. Additionally oralternatively, the mapping between the component identifiers and pick &place machine-specific component supply parameters includes a mapping ofPCNs to component supply identifiers and a mapping of component supplyidentifiers to pick & place machine-specific component supplyparameters. Preferably, the component supply identifiers are pick &place machine-specific component supply identifiers.

In accordance with still another preferred embodiment of the presentinvention the pick & place machine-specific component shape parametersinclude at least one of component geometry parameters, componenthandling parameters, component imaging parameters, component recognitiontolerances and pick & place machine-specific procedures. Preferably, thepick & place machine-specific component shape parameters include atleast one of component geometry parameters in pick & placemachine-specific syntax, pick & place machine-specific componenthandling parameters, pick & place machine-specific component imagingparameters, pick & place machine-specific component recognitiontolerances and pick & place machine-specific procedures.

In accordance with a further preferred embodiment of the presentinvention the pick & place machine-specific component supply parametersinclude at least one of a component carrier type and pick & placemachine-specific, component carrier-specific parameters. Preferably, atleast part of the pick & place machine-specific component data includesadaptive pick & place machine-specific component data. More preferably,the adaptive pick & place machine specific component data includesadaptive pick & place machine specific component shape data.Additionally or alternatively the adaptive pick & place machine specificcomponent data includes adaptive pick & place machine specific componentsupply data.

In accordance with another further preferred embodiment of the presentinvention the first database includes at least one of a mapping ofCV/Cat#s to component vendor-specific component geometric parameters(CCL), a mapping of CV/Cat#s to component supply form parameters (CCSL),a mapping of PCNs to component supply form parameters (UMCSL), a mappingof PCNs to CV/Cat#s (MCVL), a mapping of DCN to PCN, a user maintainedmapping of CV/Cat# to component vendor-specific component geometricparameters (UMCL) and a mapping of PCN to generic component geometricparameters.

In accordance with still a further preferred embodiment of the presentinvention the second database includes at least one of a mapping ofcomponent manufacturer-independent component characteristics to rulesfor generating pick & place machine-specific component shape parametersand a mapping of component manufacturer-independent component supplyform characteristics to rules for generating pick & placemachine-specific component supply parameters. Preferably, the rules forgenerating pick & place machine-specific component shape parametersinclude rules for generating at least one of component geometricparameters in pick & place machine specific syntax, pick & place machinespecific component handling parameters, pick & place machine specificcomponent imaging parameters, pick & place machine specific componentrecognition tolerances and pick & place machine specific procedures.Additionally or alternatively, the rules for generating pick & placemachine-specific component supply parameters include rules forgenerating at least one of a component carrier type in pick & placemachine-specific syntax and component carrier type-specific parametersin pick & place machine-specific syntax.

In accordance with an additional preferred embodiment of the presentinvention the second database includes at least one of a mapping ofcomponent manufacturer-independent component characteristics to rulesfor generating adaptive pick & place machine-specific component shapeparameters and a mapping of component manufacturer-independent componentsupply form characteristics to rules for generating adaptive pick &place machine-specific component supply parameters. Preferably, therules for generating adaptive pick & place machine-specific componentshape parameters include rules for generating at least one of componentgeometric parameters in pick & place machine specific syntax, adaptivepick & place machine specific component handling parameters, adaptivepick & place machine specific component imaging parameters, adaptivepick & place machine specific component recognition tolerances and pick& place machine specific procedures. Additionally or alternatively, therules for generating adaptive pick & place machine-specific componentsupply parameters include rules for generating at least one of adaptivecomponent carrier type in pick & place machine-specific syntax andadaptive component carrier type-specific parameters in pick & placemachine-specific syntax. Preferably the second database is operatormodifiable.

In accordance with yet an additional preferred embodiment of the presentinvention the employing the CAD data, the bill of materials and theapproved component vendor list for automatically generating pick & placemachine specific component data for governing the operation of at leastone specific pick & place machine includes automatically generating thepick & place machine-specific component data by employing a fourthdatabase containing pick & place line and machine configurations.

In accordance with another preferred embodiment of the present inventionthe fourth database includes at least one of pick & place machineconfigurations, ordered listings of pick & place machines in at leastone machine line, pick & place machine configurations of the pick &place machines in the at least one machine line. Preferably, the pick &place machine configurations include at least one of camera types andcharacteristics, illumination types and characteristics, componentfeeder carriage types and characteristics, component feeder types andcharacteristics, nozzle types and characteristics and kineticcharacteristics of moving elements. Additionally or alternatively, thepick & place machine configurations of the pick & place machines in theat least one machine line include at least one of mounted camera types,mounted illumination types, mounted component feeder carriages, mountedcomponent feeders and mounted nozzles.

In accordance with yet another preferred embodiment of the presentinvention the employing the CAD data, the bill of materials and theapproved component vendor list for automatically generating pick & placemachine-specific component loading specification, pick & placemachine-specific component placement sequence and pick & placemachine-specific component data for governing the operation of at leastone specific pick & place machine in a manufacturing line includesemploying the CAD data, the bill of materials, the approved componentvendor list and the first database to search for component data for newcomponents and employing the first database and the second database toauto-generate the pick & place machine specific component data.

In accordance with still another preferred embodiment of the presentinvention the employing the CAD data, the bill of materials and theapproved component vendor list for automatically generating pick & placemachine-specific component loading specification, pick & placemachine-specific component placement sequence and pick & placemachine-specific component data for governing the operation of at leastone specific pick & place machine in a manufacturing line also includesprior to the employing the CAD data the bill of materials, the approvedcomponent vendor list and the first database to search for componentdata for new components, employing the CAD data, the bill of materialsand the approved component vendor list to form combined printed circuitassembly data, following the employing the first database and the seconddatabase, selecting a pick & place machine line, thereafter, employingthe combined printed circuit assembly data together with the pick &place machine specific component data to balance the pick & placemachine line and thereafter, employing a computer to provide the pick &place machine-specific component loading specification, the pick & placemachine-specific component placement sequence and the pick & placemachine-specific component data for governing the operation of at leastone specific pick & place machine in a manufacturing line to at leastone pick & place machine in the pick & place machine line. Preferably,the combined printed circuit assembly data employs PCN designations.

In accordance with an additional preferred embodiment of the presentinvention the employing the CAD data, the bill of materials, theapproved component vendor list and the first database to search forcomponent data for new components includes employing the combinedprinted circuit assembly data and the first database to search for thecomponent data for new components. Preferably, the employing thecombined printed circuit assembly data and the first database to searchfor component data for new components includes searching the firstdatabase for pick & place machine independent component supply data forthe new components and searching the first database for pick & placemachine independent geometric component data for the new components.

In accordance with another additional preferred embodiment of thepresent invention the searching the first database for pick & placemachine independent component supply data for the new componentsincludes selecting at least one PCN corresponding to ones of the newcomponents for which CSF parameters are not available, obtaining aCV/CAT# corresponding to the at least one PCN corresponding to ones ofthe new components for which CSF parameters are not available andemploying the CV/CAT# to search at least part of the first database forcorresponding CSF parameters. Preferably, the method also includesemploying the CV/CAT# to search at least part of the first database forcorresponding default CSF parameters. Additionally or alternatively, themethod also includes employing the at least one PCN to search at leastpart of the first database for at least one corresponding set of defaultCSF parameters.

In accordance with a further preferred embodiment of the presentinvention the method also includes presenting the at least onecorresponding set of default CSF parameters and the at least one PCN toan operator for selection of an appropriate set of CSF parameters.Preferably, the method also includes, following the presenting,automatically adding the appropriate set of CSF parameters as CSFparameters to the first database for the at least one PCN andautomatically adding the appropriate set of CSF parameters as defaultCSF parameters to the first database for CV/CAT#s corresponding to theat least one PCN. Alternatively, the method also includes providingmanually generated CSF parameters for the at least one PCN,automatically adding the manually generated CSF parameters to the firstdatabase for the at least one PCN and automatically adding the manuallygenerated CSF parameters as default CSF parameters to the first databasefor CV/CAT#s corresponding to the at least one PCN.

In accordance with yet a further preferred embodiment of the presentinvention the selecting at least one PCN corresponding to ones of thenew components for which CSF parameters are not available includesselecting at least one PCN in the combined printed circuit assembly datawhich does not have CSF parameters. Alternatively, the selecting atleast one PCN corresponding to ones of the new components for which CSFparameters are not available includes selecting at least one PCN in thecombined printed circuit assembly data for which there are no pick &place machine specific component supply parameters.

In accordance with still a further preferred embodiment of the presentinvention the searching the first database for pick & place machineindependent component supply data for the new components includesselecting at least one PCN corresponding to ones of the new componentsfor which GCG parameters are not available, obtaining a CV/CAT#corresponding to the at least one PCN corresponding to ones of the newcomponents for which GCG parameters are not available and employing theCV/CAT# to search at least part of the first database for correspondingGCG parameters. Preferably, the employing the CV/CAT# also includesautomatically adding the corresponding GCG parameters to the firstdatabase for the CV/CAT# and automatically adding the corresponding GCGparameters to the first database for other CV/CAT#s corresponding to theat least one PCN corresponding to ones of the new components for whichGCG parameters are not available.

In accordance with another further preferred embodiment of the presentinvention the method also includes, following the employing the CV/CAT#,conducting a proximity search including searching the first database forat least one additional PCN having at least one corresponding CV/CAT#,which is different from the CV/CAT#, in common with the at least one PCNcorresponding to ones of the new components for which GCG parameters arenot available, searching the first database for at least one differentCV/CAT# corresponding to the at least one additional PCN, which does notcorrespond to the at least one PCN corresponding to ones of the newcomponents for which GCG parameters are not available and employing theat least one different CV/CAT# to search at least part of the firstdatabase for GCG parameters corresponding to the at least one differentCV/CAT#.

In accordance with another preferred embodiment of the present inventionthe method also includes presenting the GCG parameters corresponding tothe at least one different CV/CAT# and the at least one PCNcorresponding to ones of the new components for which GCG parameters arenot available to an operator for approval. Preferably, the method alsoincludes automatically adding the GCG parameters corresponding to the atleast one different CV/CAT# to the first database as GCG parameterscorresponding to CV/CAT#s corresponding to at least one of the at leastone PCN corresponding to ones of the new components for which GCGparameters are not available and the at least one additional PCN andautomatically indicating, for all CV/CAT#s corresponding to the at leastone PCN corresponding to ones of the new components for which GCGparameters are not available, the GCG parameters as being obtained bythe proximity search. Alternatively, the method also includes providingmanually generated GCG parameters for the CV/CAT#, automatically addingthe manually generated GCG parameters to the first database for theCV/CAT# and automatically adding the manually generated GCG parametersto the first database for CV/CAT#s corresponding to the at least one PCNcorresponding to ones of the new components for which GCG parameters arenot available.

In accordance with yet another preferred embodiment of the presentinvention the selecting at least one PCN corresponding to ones of thenew components for which GCG parameters are not available includesselecting at least one PCN in the combined printed circuit assembly datawhich does not have GCG parameters. Alternatively, the selecting atleast one PCN corresponding to ones of the new components for which GCGparameters are not available includes selecting at least one PCN in thecombined printed circuit assembly data for which there are no pick &place machine specific component shape parameters.

In accordance with still another preferred embodiment of the presentinvention the employing the first database and the second database toauto-generate the pick & place machine specific component data includesemploying the pick & place machine independent component supply data andthe machine-specific, component manufacturer-independent rules forgenerating the pick & place machine-specific component data toauto-generate pick & place machine specific component supply parametersand employing the pick & place machine independent geometric componentdata and the machine-specific, component manufacturer-independent rulesfor generating the pick & place machine-specific component data toauto-generate pick & place machine specific component shape parameters.

In accordance with a further preferred embodiment of the presentinvention the employing the pick & place machine independent componentsupply data includes for a specific pick & place machine in the pick &place machine line, selecting at least one PCN in the combined printedcircuit assembly data for which at least one of corresponding pick &place machine specific component supply parameters and a correspondingpick & place machine specific component supply identifier is notavailable, employing at least one generic component supply identifier toobtain CSF parameters corresponding to the at least one PCN in thecombined printed circuit assembly data for which at least one ofcorresponding pick & place machine specific component supply parametersand a corresponding pick & place machine specific component supplyidentifier is not available, employing at least part of the CSFparameters to access appropriate ones of the machine-specific, componentmanufacturer-independent rules for generating the pick & placemachine-specific component data, operating the appropriate ones of themachine-specific, component manufacturer-independent rules forgenerating the pick & place machine-specific component data based on atleast one of the CSF parameters to yield corresponding values andassigning the corresponding values to corresponding ones of the pick &place machine-specific component supply parameters. Preferably, themethod also includes, prior to the employing at least part of the CSFparameters to access appropriate ones of the machine-specific, componentmanufacturer-independent rules, employing at least part of the CSFparameters to auto-generate the corresponding pick & place machinespecific component supply identifier.

In accordance with yet a further preferred embodiment of the presentinvention the employing the pick & place machine independent geometriccomponent data includes for a specific pick & place machine in the pick& place machine line, selecting at least one PCN in the combined printedcircuit assembly data for which at least one of corresponding pick &place machine specific component shape parameters and a correspondingpick & place machine specific component shape identifier is notavailable, employing at least one generic component shape identifier toobtain GCG parameters corresponding to the at least one PCN in thecombined printed circuit assembly data for which at least one ofcorresponding pick & place machine specific component shape parametersand a corresponding pick & place machine specific component shapeidentifier is not available, employing at least part of the GCGparameters to access appropriate ones of the machine-specific, componentmanufacturer-independent rules for generating the pick & placemachine-specific component data, operating the appropriate ones of themachine-specific, component manufacturer-independent rules forgenerating the pick & place machine-specific component data based on atleast one of the GCG parameters to yield corresponding values andassigning the corresponding values to corresponding ones of the pick &place machine-specific component shape parameters. Preferably, themethod also includes, prior to the employing at least part of the GCGparameters to access appropriate ones of the machine-specific, componentmanufacturer-independent rules, employing at least part of the GCGparameters to auto-generate the corresponding pick & place machinespecific component shape identifier.

In accordance with still a further preferred embodiment of the presentinvention the method also includes, prior to the employing the CAD data,the bill of materials, the approved component vendor list and the firstdatabase, automatically populating a CCL portion of the first database.Preferably, the automatically populating includes employing a componentlibrary which maps CV/CAT#s to component packaging shape parameters.Additionally or alternatively, the employing a component libraryincludes employing the component library which includes a first stagemapping which maps CV/CAT#s to component packaging shape identifiers anda second stage mapping which maps the component packaging shapeidentifiers to component packaging shape parameters.

In accordance with another preferred embodiment of the present inventionthe automatically populating includes obtaining at least one CV/CAT# forwhich no mapping exists in the CCL portion, employing the first stagemapping to obtain a component packaging shape identifier correspondingto the at least one CV/CAT#, employing the second stage mapping toobtain component packaging shape parameters corresponding to thecomponent packaging shape identifier corresponding to the at least oneCV/CAT#, employing the component packaging shape identifiercorresponding to the at least one CV/CAT#; and the component packagingshape parameters corresponding to the component packaging shapeidentifier to provide an auto-generated generic component shapeidentifier and auto-generated GCG parameters and adding theauto-generated generic component shape identifier and the auto-generatedGCG parameters to the CCL portion for the at least one CV/CAT#.Preferably, the automatically populating also includes, prior to theadding, employing the auto-generated generic component shape identifierto search the CCL portion for corresponding, previously generated GCGparameters, comparing the previously generated GCG parameters and theauto-generated GCG parameters and if discrepancies are found, modifyingthe auto-generated generic component shape identifier to provide amodified generic component shape identifier and adding the modifiedgeneric component shape identifier and the auto-generated GCG parametersto the CCL portion for the at least one CV/CAT#.

In accordance with yet another preferred embodiment of the presentinvention the method also includes, following the employing the combinedprinted circuit assembly data together with the pick & place machinespecific component data to balance the pick & place machine line,assigning suitable variables to adaptive ones of the pick & placemachine specific component data to provide pick & place machine specificcomponent data which corresponds to a specific pick & place machineconfiguration for at least one pick & place machine in the pick & placemachine line. Preferably, the employing the CAD data, the bill ofmaterials and the approved component vendor list for automaticallygenerating does not require operator entry of pick & placemachine-specific component data.

There is also provided in accordance with another preferred embodimentof the present invention a method of manufacturing electronic circuitsincluding generating CAD data, a bill of materials and an approvedcomponent vendor list for an electronic circuit and employing at leastthe CAD data, the bill of materials and the approved component vendorlist for automatically locating generic component geometric parameterscorresponding to components in the CAD data, including employing atleast one database for automatically locating at least one equivalent ofones of the components for which generic component geometric parametersare not available and providing generic component geometric parameterscorresponding to the at least one equivalent as generic componentgeometric parameters corresponding to the ones of the components forwhich generic component geometric parameters are not available.

In accordance with a preferred embodiment of the present invention theat least one database includes a database containing pick & placemachine-independent, geometric component data. Preferably, the databasecontaining pick & place machine-independent, geometric component dataincludes at least one of a mapping of CV/Cat#s to componentvendor-specific component geometric parameters (CCL), a mapping ofCV/Cat#s to component supply form parameters (CCSL), a mapping of PCNsto component supply form parameters (UMCSL), a mapping of PCNs toCV/Cat#s (MCVL), a mapping of DCN to PCN, a user maintained mapping ofCV/Cat# to component vendor-specific component geometric parameters(UMCL) and a mapping of PCN to generic component geometric parameters.

In accordance with another preferred embodiment of the present inventionthe employing at least one database for automatically locating includesselecting at least one PCN corresponding to each of the ones of thecomponents, employing the at least one database to obtain at least oneCV/CAT# corresponding to the at least one PCN, searching the at leastone database for at least one additional PCN having at least oneadditional corresponding CV/CAT#, which is different from the at leastone CV/CAT#, in common with the at least one PCN, searching the at leastone database for at least one different CV/CAT# corresponding to the atleast one additional PCN, which does not correspond to the at least onePCN and employing the at least one different CV/CAT# to search at leastpart of the at least one database for generic component geometricparameters corresponding to the at least one different CV/CAT#.Preferably, the providing generic component geometric includespresenting the generic component geometric parameters corresponding tothe at least one different CV/CAT# together with the at least one PCN toan operator for approval.

In accordance with still another preferred embodiment of the presentinvention the providing generic component geometric parameters alsoincludes automatically adding the generic component geometric parameterscorresponding to the at least one different CV/CAT# to the at least onedatabase as generic component geometric parameters corresponding toCV/CAT#s corresponding to at least one of the at least one PCN and theat least one additional PCN and automatically indicating, for allCV/CAT#s corresponding to the at least one PCN, the generic componentgeometric parameters corresponding to the at least one different CV/CAT#as being obtained by a proximity search. Additionally or alternatively,the providing generic component geometric parameters also includesproviding manually generated generic component geometric parameters forthe at least one CV/CAT#, automatically adding the manually generatedgeneric component geometric parameters to the at least one database forthe at least one CV/CAT# and automatically adding the manually generatedgeneric component geometric parameters to the at least one database forCV/CAT#s corresponding to the at least one PCN.

There is further provided in accordance with a further preferredembodiment of the present invention a method of manufacturing anelectronic circuit including employing a pick & place machine-specificcomponent placement sequence, pick & place machine-specific componentdata for governing the operation of at least one specific pick & placemachine in a manufacturing line and operating instructions incomputer-readable language for the at least one specific pick & placemachine to auto-generate generic component parameters for componentsused in manufacturing the electronic circuit on the at least onespecific pick & place machine and employing the generic componentparameters to auto-generate a pick & place machine-specific componentplacement sequence and pick & place machine-specific component data forgoverning the operation of at least one other specific pick & placemachine in a manufacturing line and operating instructions incomputer-readable language for the at least one other specific pick &place machine.

In accordance with a preferred embodiment of the present invention theat least one other specific pick & place machine is a different type ofpick & place machine from the at least one specific pick & placemachine. Preferably, the employing a pick & place machine-specificcomponent placement sequence, includes employing at least a firstdatabase containing at least one of pick & place machine independentgeometric component data and pick & place machine-independent, componentsupply data and a second database containing componentmanufacturer-independent, pick & place machine-specific rules.Additionally, the at least second database includes at least one of thefollowing mappings a mapping of pick & place machine-specific componentshape parameters to rules for generating componentmanufacturer-independent generic component geometric parameters, amapping of pick & place machine-specific component supply parameters torules for generating component manufacturer-independent genericcomponent supply form parameters and a mapping of PCN parameters in pick& place machine specific syntax to generic PCN parameters.

In accordance with another preferred embodiment of the present inventionthe first database includes at least one of a mapping of CV/Cat#s tocomponent vendor-specific component geometric parameters (CCL), amapping of CV/Cat#s to component supply form parameters (CCSL), amapping of PCNs to component supply form parameters (UMCSL), a mappingof PCNs to CV/Cat#s (MCVL), a mapping of DCN to PCN, a user maintainedmapping of CV/Cat# to component vendor-specific component geometricparameters (UMCL) and a mapping of PCN to generic component geometricparameters.

In accordance with yet another preferred embodiment of the presentinvention the employing a pick & place machine-specific componentplacement sequence, pick & place machine-specific component data forgoverning the operation of at least one specific pick & place machine ina manufacturing line and operating instructions in computer-readablelanguage for the at least one specific pick & place machine toauto-generate generic component parameters for components used inmanufacturing the electronic circuit on the at least one specific pick &place machine also includes obtaining at least one PCN for ones of thecomponents used in manufacturing the electronic circuit, employing theat least one PCN and a type of the at least one specific pick & placemachine to access relevant ones of the componentmanufacturer-independent, pick & place machine-specific rules, operatingthe ones of the component manufacturer-independent, pick & placemachine-specific rules using at least one pick & place machine specificcomponent parameter to obtain corresponding values and assigning thevalues to corresponding generic component parameters. Preferably, theobtaining includes obtaining the at least one PCN from the operatinginstructions in computer-readable language.

In accordance with still another preferred embodiment of the presentinvention the operating includes operating ones of the componentmanufacturer-independent, pick & place machine-specific rules which aresuitable for auto-generation of generic component supply form parametersusing at least one pick & place machine specific component supplyparameter to obtain a corresponding supply form value and the assigningincludes assigning the corresponding supply form value to acorresponding generic component supply form parameter. Additionally oralternatively, the operating includes operating ones of the componentmanufacturer-independent, pick & place machine-specific rules which aresuitable for auto-generation of generic component geometric parametersusing at least one pick & place machine specific component shapeparameter to obtain a corresponding geometric value and the assigningincludes assigning the corresponding geometric value to a correspondinggeneric component geometric parameter. Preferably, the method alsoincludes, following the assigning, adding the values and thecorresponding generic component parameters to the first database for theat least one PCN and subsequently, indicating the values and thecorresponding generic component parameters that were obtained byindirect association.

In accordance with a further preferred embodiment of the presentinvention the method also includes, prior to the employing a pick &place machine-specific component placement sequence, obtaining at leastone PCN for each of the components, searching the first database forpick & place machine independent component supply data corresponding tothe at least one PCN for each of the components and searching the firstdatabase for pick & place machine independent geometric component datacorresponding to the at least one PCN for each of the components.

In accordance with still a further preferred embodiment of the presentinvention the employing the generic component parameters includesemploying generic component supply form parameters and the seconddatabase for auto-generating pick & place machine specific componentsupply parameters and employing the generic component geometricparameters and the second database for auto-generating pick & placemachine specific component shape parameters. Preferably, the employinggeneric component supply form parameters includes selecting at least onePCN corresponding to each of the components, employing at least part ofthe generic component supply form parameters to access appropriate onesof the machine-specific, component manufacturer-independent rules forgenerating the pick & place machine-specific component data, operatingthe appropriate ones of the machine-specific, componentmanufacturer-independent rules based on the third database and at leastone of the generic component parameters to yield corresponding valuesand assigning the corresponding values to corresponding ones of the pick& place machine-specific component supply parameters.

In accordance with yet a further preferred embodiment of the presentinvention the method also includes, prior to the employing at least partof the generic component supply form parameters, employing at least partof the generic component supply form parameters to auto-generate thecorresponding pick & place machine specific component supply identifier.

In accordance with an additional preferred embodiment of the presentinvention the employing the generic component geometric parametersincludes selecting at least one PCN corresponding to each of thecomponents, employing at least part of the generic component geometricparameters to access appropriate ones of the machine-specific, componentmanufacturer-independent rules for generating the pick & placemachine-specific component data, operating the appropriate ones of themachine-specific, component manufacturer-independent rules forgenerating the pick & place machine-specific component data based on atleast one of the generic component geometric parameters to yieldcorresponding values and assigning the corresponding values tocorresponding ones of the pick & place machine-specific component shapeparameters. Preferably, the method also includes, prior to the employingat least part of the generic component geometric parameters, employingat least part of the generic component geometric parameters toauto-generate a corresponding pick & place machine specific componentshape identifier.

There is additionally provided in accordance with an additionalpreferred embodiment of the present invention a method of manufacturingan electronic circuit including employing a pick & placemachine-specific component placement sequence, pick & placemachine-specific component data for governing the operation of at leastone specific pick & place machine in a manufacturing line and operatinginstructions in computer-readable language for the at least one specificpick & place machine to obtain generic component geometric parametersfor at least one specific component used in manufacturing the electroniccircuit on the at least one specific pick & place machine and employingthe generic component geometric parameters to auto-generate a pick &place machine-specific component placement sequence, pick & placemachine-specific component data for governing the operation of the atleast one specific pick & place machine and operating instructions incomputer-readable language for the at least one specific pick & placemachine when the at least one specific component is replaced by at leastone substitute component.

In accordance with a preferred embodiment of the present invention theemploying a pick & place machine-specific component placement sequenceincludes obtaining at least one PCN corresponding to the at least onespecific component, employing a database including pick & place machineindependent geometric component data to obtain at least one CV/CAT#corresponding to the at least one PCN and employing the database and theat least one CV/CAT# to obtain generic component geometric parametersfor the at least one specific component.

In accordance with another preferred embodiment of the present inventionthe employing the generic component geometric parameters includesobtaining at least one substitute PCN corresponding to the at least onesubstitute component, employing the database to obtain at least onesubstitute CV/CAT# corresponding to the at least one substitute PCN,employing the database and the at least one substitute CV/CAT# to obtaingeneric component geometric parameters for the at least one substitutecomponent and comparing the generic component geometric parameters forthe at least one specific component and the generic component geometricparameters for the at least one substitute component.

In accordance with yet another preferred embodiment of the presentinvention the employing the generic component geometric parameters alsoincludes, following the comparing, employing the database andmachine-specific, component manufacturer-independent rules forgenerating pick & place machine-specific component shape parameters toauto-generate pick & place machine specific component shape parametersand employing the pick & place machine specific component shapeparameters to auto-generate the pick & place machine-specific componentplacement sequence, the pick & place machine-specific component data forgoverning the operation of the at least one specific pick & placemachine and the operating instructions in computer-readable language forthe at least one specific pick & place machine.

In accordance with a further preferred embodiment of the presentinvention the employing the database and machine-specific, componentmanufacturer-independent rules includes employing at least part of thegeneric component geometric parameters for the at least one substitutecomponent to access appropriate ones of the machine-specific, componentmanufacturer-independent rules for generating the pick & placemachine-specific component shape parameters, operating the appropriateones of the machine-specific, component manufacturer-independent rulesfor generating the pick & place machine-specific component shapeparameters based on at least one of the generic component geometricparameters for the at least one substitute component to yieldcorresponding values and assigning the corresponding values tocorresponding ones of the pick & place machine-specific component shapeparameters.

There is also provided in accordance with another preferred embodimentof the present invention apparatus for manufacturing electronic circuitsincluding a computerized electronic circuit data generator operative forgenerating CAD data, a bill of materials and an approved componentvendor list for an electronic circuit and a computerized generatoroperative for employing the CAD data, the bill of materials and theapproved component vendor list for automatically generating a pick &place machine-specific component loading specification, a pick & placemachine-specific component placement sequence and pick & placemachine-specific component data for governing the operation of at leastone specific pick & place machine in a manufacturing line.

In accordance with a preferred embodiment of the present invention thecomputerized generator includes a first database containing at least oneof pick & place machine-independent, geometric component data and pick &place machine-independent, component supply data and a second databasecontaining machine-specific, component manufacturer-independent rulesfor generating the pick & place machine-specific component data.Preferably, the pick & place machine specific component data forgoverning the operation of at least one specific pick & place machineincludes at least one of pick & place machine-specific component shapeparameters and pick & place machine-specific component supplyparameters.

In accordance with another preferred embodiment of the present inventionthe computerized generator is also operative for automaticallygenerating a third database containing at least a mapping betweencomponent identifiers and pick & place machine-specific component shapeparameters and a mapping between the component identifiers and pick &place machine-specific component supply parameters. Preferably, themapping between component identifiers and pick & place machine-specificcomponent shape parameters includes a mapping of PCNs to component shapeidentifiers and a mapping of component shape identifiers to pick & placemachine-specific component shape parameters. Additionally oralternatively, the component shape identifiers are pick & placemachine-specific component shape identifiers.

In accordance with yet another preferred embodiment of the presentinvention the mapping between the component identifiers and pick & placemachine-specific component supply parameters includes a mapping of PCNsto component supply identifiers and a mapping of component supplyidentifiers to pick & place machine-specific component supplyparameters. Preferably, the component supply identifiers are pick &place machine-specific component supply identifiers.

In accordance with still another preferred embodiment of the presentinvention the pick & place machine-specific component shape parametersinclude at least one of component geometry parameters, componenthandling parameters, component imaging parameters, component recognitiontolerances and pick & place machine-specific procedures. Preferably, thepick & place machine-specific component shape parameters include atleast one of component geometry parameters in pick & placemachine-specific syntax, pick & place machine-specific componenthandling parameters, pick & place machine-specific component imagingparameters, pick & place machine-specific component recognitiontolerances and pick & place machine-specific procedures.

In accordance with a further preferred embodiment of the presentinvention the pick & place machine-specific component supply parametersinclude at least one of a component carrier type and pick & placemachine-specific, component carrier-specific parameters. Preferably, atleast part of the pick & place machine-specific component data includesadaptive pick & place machine-specific component data. Additionally oralternatively, the adaptive pick & place machine specific component dataincludes adaptive pick & place machine specific component shape data. Asa further alternative, the adaptive pick & place machine specificcomponent data includes adaptive pick & place machine specific componentsupply data.

In accordance with yet another preferred embodiment of the presentinvention the first database includes at least one of a mapping ofCV/Cat#s to component vendor-specific component geometric parameters(CCL), a mapping of CV/Cat#s to component supply form parameters (CCSL),a mapping of PCNs to component supply form parameters (UMCSL), a mappingof PCNs to CV/Cat#s (MCVL), a mapping of DCN to PCN, a user maintainedmapping of CV/Cat# to component vendor-specific component geometricparameters (UMCL) and a mapping of PCN to generic component geometricparameters.

In accordance with still another preferred embodiment of the presentinvention the second database includes at least one of a mapping ofcomponent manufacturer-independent component characteristics to rulesfor generating pick & place machine-specific component shape parametersand a mapping of component manufacturer-independent component supplyform characteristics to rules for generating pick & placemachine-specific component supply parameters. Preferably, the rules forgenerating pick & place machine-specific component shape parametersinclude rules for generating at least one of component geometricparameters in pick & place machine specific syntax, pick & place machinespecific component handling parameters, pick & place machine specificcomponent imaging parameters, pick & place machine specific componentrecognition tolerances and pick & place machine specific procedures.Additionally or alternatively, the rules for generating pick & placemachine-specific component supply parameters include rules forgenerating at least one of a component carrier type in pick & placemachine-specific syntax and component carrier type-specific parametersin pick & place machine-specific syntax.

In accordance with a further preferred embodiment of the presentinvention the second database includes at least one of a mapping ofcomponent manufacturer-independent component characteristics to rulesfor generating adaptive pick & place machine-specific component shapeparameters and a mapping of component manufacturer-independent componentsupply form characteristics to rules for generating adaptive pick &place machine-specific component supply parameters. Preferably, therules for generating adaptive pick & place machine-specific componentshape parameters include rules for generating at least one of componentgeometric parameters in pick & place machine specific syntax, adaptivepick & place machine specific component handling parameters, adaptivepick & place machine specific component imaging parameters, adaptivepick & place machine specific component recognition tolerances and pick& place machine specific procedures.

In accordance with yet a further preferred embodiment of the presentinvention the rules for generating adaptive pick & placemachine-specific component supply parameters include rules forgenerating at least one of adaptive component carrier type in pick &place machine-specific syntax and adaptive component carriertype-specific parameters in pick & place machine-specific syntax.Preferably, the second database is operator modifiable.

In accordance with still another preferred embodiment of the presentinvention the computerized generator includes a fourth databasecontaining pick & place line and machine configurations. Preferably, thefourth database includes at least one of pick & place machineconfigurations, ordered listings of pick & place machines in at leastone machine line and pick & place machine configurations of the pick &place machines in the at least one machine line.

In accordance with a further preferred embodiment of the presentinvention the pick & place machine configurations include at least oneof camera types and characteristics, illumination types andcharacteristics, component feeder carriage types and characteristics,component feeder types and characteristics, nozzle types andcharacteristics and kinetic characteristics of moving elements.Preferably, the pick & place machine configurations of the pick & placemachines in the plurality of machine lines include at least one ofmounted camera types, mounted illumination types, mounted componentfeeder carriages, mounted component feeders and mounted nozzles.

In accordance with yet a further preferred embodiment of the presentinvention the computerized generator includes computerized new componentdata searching functionality operative to employ the CAD data, the billof materials, the approved component vendor list and the first databaseto search for component data for new components and computerizedauto-generation functionality operative to employ the first database andthe second database to auto-generate the pick & place machine specificcomponent data. Preferably, the computerized generator also includes acomputerized combined printed circuit assembly data generator operativeto employ the CAD data, the bill of materials and the approved componentvendor list to form combined printed circuit assembly data, acomputerized line selector operative to select a pick & place machineline, computerized line balancing functionality operative to employ thecombined printed circuit assembly data together with the pick & placemachine specific component data to balance the pick & place machineline.

In accordance with still another preferred embodiment of the presentinvention the combined printed circuit assembly data employs PCNdesignations. Preferably, the computerized new component data searchingfunctionality includes computerized component supply data searchingfunctionality operative to search the first database for pick & placemachine independent component supply data for the new components andcomputerized component shape data searching functionality operative tosearch the first database for pick & place machine independent geometriccomponent data for the new components. Preferably, the computerizedcomponent supply data searching functionality includes a PCN selectoroperative to select at least one PCN corresponding to ones of the newcomponents for which CSF parameters are not available, CSF CV/CAT#obtaining functionality operative to obtain a CV/CAT# corresponding tothe at least one PCN corresponding to ones of the new components forwhich CSF parameters are not available and CSF searching functionalityoperative to employ the CV/CAT# to search at least part of the firstdatabase for corresponding CSF parameters.

In accordance with an additional preferred embodiment of the presentinvention the computerized component shape data searching functionalityincludes a PCN selector operative to select at least one PCNcorresponding to ones of the new components for which GCG parameters arenot available, GCG CV/CAT# obtaining functionality operative to obtain aCV/CAT# corresponding to the at least one PCN corresponding to ones ofthe new components for which GCG parameters are not available and GCGsearching functionality operative to employ the CV/CAT# to search atleast part of the first database for corresponding GCG parameters.

In accordance with another additional preferred embodiment of thepresent invention the computerized component shape data searchingfunctionality also includes computerized proximity searchingfunctionality, including first computerized searching functionalityoperative to search the first database for at least one additional PCNhaving at least one corresponding CV/CAT#, which is different from theCV/CAT#, in common with the at least one PCN corresponding to ones ofthe new components for which GCG parameters are not available, secondcomputerized searching functionality operative to search the firstdatabase for at least one different CV/CAT# corresponding to the atleast one additional PCN, which does not correspond to the at least onePCN corresponding to ones of the new components for which GCG parametersare not available and proximate GCG parameter searching functionalityoperative to employ the at least one different CV/CAT# to search atleast part of the first database for GCG parameters corresponding to theat least one different CV/CAT#.

In accordance with another preferred embodiment of the present inventionthe computerized auto-generation functionality includes component supplyparameter auto-generation functionality operative to employ the firstdatabase and the second database to auto-generate pick & place machinespecific component supply parameters and component shape parameterauto-generation functionality operative to employ the first database andthe second database to auto-generate pick & place machine specificcomponent shape parameters. Preferably, the component supply parameterauto-generation functionality includes a PCN selector operative, for aspecific pick & place machine in the pick & place machine line, toselect at least one PCN in the combined printed circuit assembly datafor which at least one of corresponding pick & place machine specificcomponent supply parameters and a corresponding pick & place machinespecific component supply identifier is not available, CSF parameterobtaining functionality operative to employ at least one genericcomponent supply identifier to obtain CSF parameters corresponding tothe at least one PCN in the combined printed circuit assembly data forwhich at least one of corresponding pick & place machine specificcomponent supply parameters and a corresponding pick & place machinespecific component supply identifier is not available, rules operatingfunctionality operative to employ at least part of the CSF parameters toaccess appropriate ones of the machine-specific, componentmanufacturer-independent rules for generating the pick & placemachine-specific component data and to operate the appropriate ones ofthe machine-specific, component manufacturer-independent rules forgenerating the pick & place machine-specific component data based on atleast one of the CSF parameters to yield corresponding values and valueassigning functionality operative to assign the corresponding values tocorresponding ones of the pick & place machine-specific component supplyparameters.

In accordance with still another preferred embodiment of the presentinvention the component supply parameter auto-generation functionalityalso includes component supply identifier auto-generation functionalityoperative to employ at least part of the CSF parameters to auto-generatethe corresponding pick & place machine specific component supplyidentifier. Preferably, the component shape parameter auto-generationfunctionality includes a PCN selector operative, for a specific pick &place machine in the pick & place machine line, to select at least onePCN in the combined printed circuit assembly data for which at least oneof corresponding pick & place machine specific component shapeparameters and a corresponding pick & place machine specific componentshape identifier is not available, GCG parameter obtaining functionalityoperative to employ at least one generic component shape identifier toobtain GCG parameters corresponding to the at least one PCN in thecombined printed circuit assembly data for which at least one ofcorresponding pick & place machine specific component shape parametersand a corresponding pick & place machine specific component shapeidentifier is not available, rules operating functionality operative toemploy at least part of the GCG parameters to access appropriate ones ofthe machine-specific, component manufacturer-independent rules forgenerating the pick & place machine-specific component data and tooperate the appropriate ones of the machine-specific, componentmanufacturer-independent rules for generating the pick & placemachine-specific component data based on at least one of the GCGparameters to yield corresponding values and value assigningfunctionality operative to assign the corresponding values tocorresponding ones of the pick & place machine-specific component shapeparameters.

In accordance with another preferred embodiment of the present inventionthe component shape parameter auto-generation functionality alsoincludes component shape identifier auto-generation functionalityoperative to employ at least part of the GCG parameters to auto-generatethe corresponding pick & place machine specific component shapeidentifier. Preferably, the apparatus also includes a computerizeddatabase populating functionality operative to automatically populate aCCL portion of the first database. Additionally or alternatively, thecomputerized database populating functionality also includes componentlibrary which maps CV/CAT#s to component packaging shape parameters.

In accordance with yet another preferred embodiment of the presentinvention the component library includes a first stage mapping whichmaps CV/CAT#s to component packaging shape identifiers and a secondstage mapping which maps the component packaging shape identifiers tocomponent packaging shape parameters. Preferably, the computerizeddatabase populating functionality includes CV/CAT# obtainingfunctionality operative to obtain at least one CV/CAT# for which nomapping exists in the CCL portion, component packaging shape identifierobtaining functionality operative to employ the first stage mapping toobtain a component packaging shape identifier corresponding to the atleast one CV/CAT# and component packaging shape parameter obtainingfunctionality operative to employ the second stage mapping to obtaincomponent packaging shape parameters corresponding to the componentpackaging shape identifier corresponding to the at least one CV/CAT#.

In accordance with still another preferred embodiment of the presentinvention the apparatus also includes value assigning functionalityoperative to assign suitable variables to adaptive ones of the pick &place machine specific component data to provide pick & place machinespecific component data which corresponds to a specific pick & placemachine configuration for at least one pick & place machine in the pick& place machine line.

There is additionally provided in accordance with a further preferredembodiment of the present invention apparatus for manufacturingelectronic circuits including a computerized electronic circuit datagenerator operative to generate CAD data, a bill of materials and anapproved component vendor list for an electronic circuit andcomputerized component parameter locating functionality operative toemploy at least the CAD data, the bill of materials and the approvedcomponent vendor list for automatically locating generic componentgeometric parameters corresponding to components in the CAD data, thecomputerized component parameter locating functionality including atleast one database, computerized equivalents locating functionalityoperative to automatically locate in the at least one database at leastone equivalent of ones of the components for which generic componentgeometric parameters are not available and parameter providingfunctionality operative to provide generic component geometricparameters corresponding to the at least one equivalent as genericcomponent geometric parameters corresponding to the ones of thecomponents for which generic component geometric parameters are notavailable.

In accordance with a preferred embodiment of the present invention theat least one database includes a database containing pick & placemachine-independent, geometric component data. Preferably, the databasecontaining pick & place machine-independent, geometric component dataincludes at least one of a mapping of CV/Cat#s to componentvendor-specific component geometric parameters (CCL), a mapping ofCV/Cat#s to component supply form parameters (CCSL), a mapping of PCNsto component supply form parameters (UMCSL), a mapping of PCNs toCV/Cat#s (MCVL), a mapping of DCN to PCN, a user maintained mapping ofCV/Cat# to component vendor-specific component geometric parameters(UMCL) and a mapping of PCN to generic component geometric parameters.

In accordance with another preferred embodiment of the present inventionthe computerized equivalents locating functionality includescomputerized PCN selection functionality operative to select at leastone PCN corresponding to each of the ones of the components, CV/CAT#obtaining functionality operative to employ the at least one database toobtain at least one CV/CAT# corresponding to the at least one PCN,computerized searching functionality operative to search the at leastone database for at least one additional PCN having at least oneadditional corresponding CV/CAT#, which is different from the at leastone CV/CAT#, in common with the at least one PCN and for at least onedifferent CV/CAT# corresponding to the at least one additional PCN,which does not correspond to the at least one PCN and computerizedcomponent parameter searching functionality operative to employ the atleast one different CV/CAT# to search at least part of the at least onedatabase for generic component geometric parameters corresponding to theat least one different CV/CAT#. Preferably, the providing genericcomponent geometric includes presenting the generic component geometricparameters corresponding to the at least one different CV/CAT# togetherwith the at least one PCN to an operator for approval.

There is further provided in accordance with a further preferredembodiment of the present invention apparatus for manufacturing anelectronic circuit including computerized generic component parameterauto-generation functionality operative to employ a pick & placemachine-specific component placement sequence, pick & placemachine-specific component data for governing the operation of at leastone specific pick & place machine in a manufacturing line and operatinginstructions in computer-readable language for the at least one specificpick & place machine to auto-generate generic component parameters forcomponents used in manufacturing the electronic circuit on the at leastone specific pick & place machine and computerized machine parameterauto-generation functionality operative to employ the generic componentparameters to auto-generate a pick & place machine-specific componentplacement sequence and pick & place machine-specific component data forgoverning the operation of at least one other specific pick & placemachine in a manufacturing line and operating instructions incomputer-readable language for the at least one other specific pick &place machine.

In accordance with a preferred embodiment of the present invention theat least one other specific pick & place machine is a different type ofpick & place machine from the at least one specific pick & placemachine. Preferably, the computerized generic component parameterauto-generation functionality includes a first database containing atleast one of pick & place machine independent geometric component dataand pick & place machine-independent, component supply data and a seconddatabase containing component manufacturer-independent, pick & placemachine-specific rules.

In accordance with another preferred embodiment of the present inventionthe second database includes at least one of the following mappings amapping of pick & place machine-specific component shape parameters torules for generating component manufacturer-independent genericcomponent geometric parameters, a mapping of pick & placemachine-specific component supply parameters to rules for generatingcomponent manufacturer-independent generic component supply formparameters and a mapping of PCN parameters in pick & place machinespecific syntax to generic PCN parameters. Preferably, the firstdatabase includes at least one of a mapping of CV/Cat#s to componentvendor-specific component geometric parameters (CCL), a mapping ofCV/Cat#s to component supply form parameters (CCSL), a mapping of PCNsto component supply form parameters (UMCSL), a mapping of PCNs toCV/Cat#s (MCVL), a mapping of DCN to PCN, a user maintained mapping ofCV/Cat# to component vendor-specific component geometric parameters(UMCL) and a mapping of PCN to generic component geometric parameters.

In accordance with still another preferred embodiment of the presentinvention the computerized generic component parameter auto-generationfunctionality includes PCN obtaining functionality operative to obtainat least one PCN for ones of the components used in manufacturing theelectronic circuit, rules operating functionality operative to employthe at least one PCN and a type of the at least one specific pick &place machine to access relevant ones of the componentmanufacturer-independent, pick & place machine-specific rules and tooperate the ones of the component manufacturer-independent, pick & placemachine-specific rules using at least one pick & place machine specificcomponent parameter to obtain corresponding values and value assigningfunctionality operative to assign the values to corresponding genericcomponent parameters. Preferably, the computerized generic componentparameter auto-generation functionality also includes computerized valueaddition functionality operative to add the values and the correspondinggeneric component parameters to the first database for the at least onePCN and value indicating functionality operative to indicate the valuesand the corresponding generic component parameters that were obtained byindirect association.

In accordance with a further preferred embodiment of the presentinvention the computerized machine parameter auto-generationfunctionality includes computerized supply parameter auto-generationfunctionality operative to employ generic component supply formparameters and the second database for auto-generating pick & placemachine specific component supply parameters and computerized shapeparameter auto-generation functionality operative to employ the genericcomponent geometric parameters and the second database forauto-generating pick & place machine specific component shapeparameters. Preferably, the computerized supply parameterauto-generation functionality includes PCN selection functionalityoperative to select at least one PCN corresponding to each of thecomponents, rules operating functionality operative to employ at leastpart of the generic component supply form parameters to accessappropriate ones of the machine-specific, componentmanufacturer-independent rules for generating the pick & placemachine-specific component data and to operate the appropriate ones ofthe machine-specific, component manufacturer-independent rules based onthe third database and at least one of the generic component parametersto yield corresponding values and value assigning functionalityoperative to assign the corresponding values to corresponding ones ofthe pick & place machine-specific component supply parameters.

In accordance with another further preferred embodiment of the presentinvention the computerized supply parameter auto-generationfunctionality also includes computerized supply identifierauto-generation functionality operative to employ at least part of thegeneric component supply form parameters to auto-generate thecorresponding pick & place machine specific component supply identifier.Preferably, the computerized shape parameter auto-generationfunctionality includes PCN selection functionality operative to selectat least one PCN corresponding to each of the components, rulesoperating functionality operative to employ at least part of the genericcomponent shape parameters to access appropriate ones of themachine-specific, component manufacturer-independent rules forgenerating the pick & place machine-specific component data and tooperate the appropriate ones of the machine-specific, componentmanufacturer-independent rules based on the third database and at leastone of the generic component parameters to yield corresponding valuesand value assigning functionality operative to assign the correspondingvalues to corresponding ones of the pick & place machine-specificcomponent shape parameters.

In accordance with an additional preferred embodiment of the presentinvention the computerized shape parameter auto-generation functionalityalso includes computerized shape identifier auto-generationfunctionality operative to employ at least part of the generic componentshape parameters to auto-generate the corresponding pick & place machinespecific component shape identifier.

There is also provided in accordance with an additional preferredembodiment of the present invention apparatus for manufacturing anelectronic circuit including computerized component parameter obtainingfunctionality operative to employ a pick & place machine-specificcomponent placement sequence, pick & place machine-specific componentdata for governing the operation of at least one specific pick & placemachine in a manufacturing line and operating instructions incomputer-readable language for the at least one specific pick & placemachine to obtain generic component geometric parameters for at leastone specific component used in manufacturing the electronic circuit onthe at least one specific pick & place machine and computerizedauto-generation functionality operative to employ the generic componentgeometric parameters to auto-generate a pick & place machine-specificcomponent placement sequence, pick & place machine-specific componentdata for governing the operation of the at least one specific pick &place machine and operating instructions in computer-readable languagefor the at least one specific pick & place machine when the at least onespecific component is replaced by at least one substitute component.

In accordance with a preferred embodiment of the present invention thecomputerized component parameter obtaining functionality includes PCNobtaining functionality operative to obtain at least one of at least onePCN corresponding to the at least one specific component and at leastone substitute PCN corresponding to the at least one substitutecomponent, CV/CAT# obtaining functionality operative to employ adatabase including pick & place machine independent geometric componentdata to obtain at least one of at least one CV/CAT# corresponding to theat least one PCN and at least one substitute CV/CAT# corresponding tothe at least one substitute PCN, component geometric parameter obtainingfunctionality operative to employ the database, the at least one CV/CAT#and the at least one substitute CV/CAT# to obtain generic componentgeometric parameters for at least one of the at least one specificcomponent and at least one substitute component, geometric parametercomparing functionality operative to compare the generic componentgeometric parameters for the at least one specific component and thegeneric component geometric parameters for the at least one substitutecomponent.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will be understood and appreciated more fully fromthe following detailed description, taken in conjunction with thedrawings in which:

FIG. 1 is a simplified illustration of a system and functionality forautomated manufacture of electronic circuits in accordance with apreferred embodiment of the present invention;

FIG. 2 is a simplified, diagrammatic illustration of four databasesemployed in the system and functionality of FIG. 1 in accordance with apreferred embodiment of the present invention;

FIG. 3 is a simplified illustration of a pick & place machinevendor-independent component and supply data database employed in thesystem and functionality of FIGS. 1 and 2;

FIG. 4 is a simplified illustration of a pick & place machine-specificcomponent manufacturer-independent rules database employed in the systemand functionality of FIGS. 1 and 2;

FIGS. 5A and 5B are exemplary charts illustrating logical organizationof rules, contained in the database of FIG. 4, for generating pick &place machine-specific component supply parameters and pick & placemachine-specific component shape parameters respectively;

FIG. 6 is a simplified illustration of a pick & place machine-specificcomponent and supply data database employed in the system andfunctionality of FIGS. 1 and 2;

FIG. 7 is a simplified illustration of a pick & place line and machineconfigurations database employed in the system and functionality ofFIGS. 1 and 2;

FIGS. 8A and 8B together form a simplified flowchart illustrating theoperation of the system and functionality for automated manufacture ofelectronic circuits of FIGS. 1-7 in accordance with a preferredembodiment of the present invention;

FIG. 9 is a simplified flowchart illustrating details of New PCN/CSFSearch functionality, forming part of the functionality shown in theflowchart of FIGS. 8A and 8B;

FIG. 10 is a simplified flowchart illustrating details ofauto-generation of pick & place machine specific component supplyparameters forming part of the functionality shown in the flowchart ofFIGS. 8A and 8B;

FIGS. 11A, 11B, 11C and 11D are each a simplified diagrammaticillustration of the application of one type of pick & placemachine-specific component manufacturer-independent rules for generatinga corresponding type of pick & place machine-specific component supplyparameters employed in accordance with a preferred embodiment of thepresent invention;

FIG. 12 is a simplified flowchart illustrating details of GCG generationfunctionality, forming part of the functionality shown in the flowchartof FIGS. 8A and 8B;

FIGS. 13A and 13B together form a simplified flowchart illustratingdetails of New PCN/GCG Search functionality, forming part of thefunctionality shown in the flowchart of FIGS. 8A and 8B;

FIG. 14 is a simplified flowchart illustrating details ofauto-generation of pick & place machine specific component shapeparameters forming part of the functionality shown in the flowchart ofFIGS. 8A and 8B;

FIGS. 15A, 15B, 15C, 15D and 15E are each a simplified diagrammaticillustration of the application of one type of pick & placemachine-specific component manufacturer-independent rules for generatinga corresponding type of pick & place machine-specific component shapeparameters employed in accordance with a preferred embodiment of thepresent invention;

FIG. 16 is a simplified flowchart illustrating details of alternativeNew PCN/CSF Search functionality, forming part of the functionalityshown in the flowchart of FIGS. 8A and 8B;

FIGS. 17A and 17B together form a simplified flowchart illustratingdetails of alternative New PCN/GCG Search functionality, forming part ofthe functionality shown in the flowchart of FIGS. 8A and 8B;

FIG. 18 is a simplified illustration of a system and functionality forautomated manufacture of electronic circuits in accordance with anotherpreferred embodiment of the present invention including functionalityfor transferring production of an electronic circuit from onemanufacturing line to another manufacturing line;

FIG. 19 is a simplified illustration of a componentmanufacturer-independent, pick & place machine-specific rules databaseemployed in the system and functionality of FIG. 18;

FIGS. 20A and 20B are simplified flowcharts illustrating thefunctionality of the system of FIG. 18;

FIG. 21 is a simplified illustration of a system and functionality forautomated manufacture of electronic circuits in accordance with yetanother preferred embodiment of the present invention, includingfunctionality for modifying operating instructions when a substitutecomponent having at least one different characteristic is sought to beemployed on a manufacturing line;

FIG. 22 is a simplified flowchart illustrating the functionality of thesystem of FIG. 21;

FIG. 23 is a simplified illustration of a system and functionality forautomated manufacture of electronic circuits in accordance with stillanother preferred embodiment of the present invention includingfunctionality for auto-generation of MSSHPs and MSSUPs having enhancedgenerality;

FIG. 24 is a simplified, diagrammatic illustration of four databasesemployed in the system and functionality of FIG. 23 in accordance with apreferred embodiment of the present invention;

FIG. 25 is a simplified illustration of a pick & place machine-specificcomponent manufacturer-independent rules database employed in the systemand functionality of FIGS. 23 and 24;

FIGS. 26A and 26B are exemplary charts illustrating logical organizationof rules, contained in the database of FIG. 25, for generating adaptivepick & place machine-specific component supply parameters and adaptivepick & place machine-specific component shape parameters respectively;

FIG. 27 is a simplified illustration of a pick & place machine-specificcomponent and supply data database employed in the system andfunctionality of FIGS. 23 and 24;

FIGS. 28A and 28B together form a simplified flowchart illustrating thefunctionality of the system of FIGS. 23-27;

FIG. 29 is a simplified flowchart illustrating details ofauto-generation of adaptive pick & place machine specific componentsupply parameters forming part of the functionality shown in theflowchart of FIGS. 28A and 28B;

FIG. 30 is a simplified diagrammatic illustration of the application ofpick & place machine-specific component manufacturer-independent rulesfor generating adaptive pick & place machine-specific component supplyparameters for a specific carrier type;

FIG. 31 is a simplified flowchart illustrating details ofauto-generation of adaptive pick & place machine specific componentshape parameters forming part of the functionality shown in theflowchart of FIGS. 28A and 28B;

FIG. 32 is a simplified diagrammatic illustration of the application ofpick & place machine-specific component manufacturer-independent rulesfor generating adaptive pick & place machine-specific component handlingparameters;

FIGS. 33 and 34 are simplified diagrammatic illustrations ofspecification of the adaptive pick & place machine-specific componentsupply parameters for a reel carrier type and the adaptive pick & placemachine-specific component handling parameters shown in respective FIGS.30 and 32;

FIG. 35 is a simplified illustration of a system and functionality forautomated manufacture of electronic circuits in accordance with afurther preferred embodiment of the present invention, includingfunctionality for employing newly auto-generated pick & placemachine-specific component supply parameters and pick & placemachine-specific component shape parameters instead of earlier generatedpick & place machine-specific component supply parameters and pick &place machine-specific component shape parameters;

FIG. 36 is a simplified flowchart illustrating details ofauto-generation of pick & place machine specific component supplyparameters forming part of the functionality of FIG. 35; and

FIG. 37 is a simplified flowchart illustrating details ofauto-generation of pick & place machine specific component shapeparameters forming part of the functionality of FIG. 35.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

The present invention provides a method of manufacturing electroniccircuits including generating CAD data, a bill of materials and anapproved component vendor list for an electronic circuit and employingthe CAD data, the bill of materials and the approved component vendorlist for automatically generating a pick & place machine-specificcomponent loading specification, a pick & place machine-specificcomponent placement sequence and pick & place machine-specific componentdata for governing the operation of at least one specific pick & placemachine in a manufacturing line.

Reference is now made to FIG. 1, which is a simplified illustration of asystem and functionality for automated manufacture of electroniccircuits in accordance with a preferred embodiment of the presentinvention.

A typical context in which the present invention is used is an automatedelectronic circuit manufacture facility which includes one or moreautomated electronic circuit manufacturing lines, one of which is shownin FIG. 1 and identified generally by reference numeral 100. Eachelectronic circuit manufacturing line typically comprises a plurality ofpick & place machines which may or may not originate from the sameequipment vendor. Typically, each line comprises between one and tenpick & place machines. In FIG. 1, three such machines are illustratedand are respectively designated by reference numerals 102, 104 and 106.In the illustrated example of FIG. 1, each of pick & place machines 102,104 and 106 is supplied by a different equipment vendor.

One or more machine line programmers, operating a machine lineprogramming station 110, are responsible, inter alia, for providingoperating instructions in computer-readable language to the pick & placemachines of one or more lines 100, such as pick & place machines 102,104 and 106. The machine line programmer is also responsible forproviding operating instructions in human-readable form to one or morepick & place machine operators who configure the pick & place machinesand load components onto the machines. These human-readable instructionsmay be provided to the operators via respective displays 112, 114 and116, on pick & place machines 102, 104 and 106, or, preferably, viahand-held terminals 118 or, alternatively, in hard copy.

In accordance with a preferred embodiment of the present invention, themachine line programmer employs an embodiment of the present inventionwhich is preferably embodied in software loaded onto one or morecomputers forming part of machine line programming station 110. Themachine line programmer also employs electronic circuit design andspecification data specific to each electronic circuit to bemanufactured. This data is preferably supplied via a computer network120 from one or more remote servers 122, directly to one or morecomputers forming part of machine line programming station 110 andpreferably includes CPL, ACVL and BOM data, respectively designated byreference numerals 124, 126 and 128.

In processing the received CPL 124, ACVL 126 and BOM 128 data to provideoperating instructions, the machine line programmer preferably employsdatabases 130 preferably including at least four databases, identifiedin FIG. 1 as databases A, B, C and D. As indicated in FIG. 2, to whichreference is now additionally made, databases A, B, C and D may becharacterized as follows:

Database A—containing pick & place machine vendor-independent componentand supply data;

Database B—containing pick & place machine-specific componentmanufacturer-independent rules;

Database C—containing pick & place machine-specific component and supplydata; and

Database D—containing pick & place line and machine configurations.

FIG. 2 diagrammatically illustrates that in accordance with a preferredembodiment of the present invention databases A, B and D are employed incombination in accordance with the present invention to automaticallygenerate at least part of the content of database C.

As seen in FIG. 1, preferably the machine line programming station 110,using software of the present invention, employs the received CPL 124,ACVL 126 and BOM 128 data and databases A, B and possibly D to performauto-generation of pick & place machine-specific component shapeparameters and pick & place machine-specific component supply parameterswhich are preferably incorporated into database C, as describedhereinbelow.

As also seen in FIG. 1, the machine line programming station 110, usingsoftware of the present invention, preferably employs the received CPL124, ACVL 126 and BOM 128 data and databases A-D to perform linebalancing and programming functions, the outputs of which are pick &place machine-specific component shape and supply parameters which aresupplied to pick & place machines 102, 104 and 106 in a machine-readablelanguage which is readable by each specific machine and human-readablemachine feeder set-up instructions specifically adapted for each of thepick & place machines 102, 104 and 106.

Reference is now made to FIG. 3, which illustrates the structure andcontent of database A. As seen in FIG. 3, database A includes aplurality of mappings, each shown enclosed in a rectangle, which arepreferably employed to enhance the accessibility of the informationstored in the database.

A first mapping, here designated by reference numeral 150, maps designercomponent numbers (DCN) appearing in the BOM 128 (FIG. 1) to programmercomponent numbers (PCN). Preferably, this is a one-to-one mapping, butalternatively may be a many-to-many mapping. A separate mapping 150 ispreferably provided for the designer component numbers (DCN) of eachseparate design center.

A second mapping, here designated by reference numeral 152 and referredto hereinafter as MCVL, maps programmer component numbers (PCN) tocomponent vendor/catalog number pairs (CV/CAT#). This is a many-to-manymapping.

A third mapping, here designated by reference numeral 153 and referredto hereinafter as CCSL, maps CV/CAT#s to component supply form (CSF)parameters. This is preferably a many-to-one mapping. This mappingincludes two stages: an initial stage mapping, designated by referencenumeral 154, which includes a many-to-one mapping of componentvendor/catalog number pairs (CV/CAT#) to generic component supplyidentifiers, and a second stage mapping, designated by reference numeral155, which includes a one-to-one mapping of generic component supplyidentifiers to component supply form (CSF) parameters.

A fourth mapping, here designated by reference numeral 156 and referredto hereinafter as UMCSL, maps programmer component numbers (PCN) tocomponent supply form (CSF) parameters and is maintained by the machineline programmer using station 110 (FIG. 1). This is preferably amany-to-one mapping. This mapping includes two stages: an initial stagemapping, designated by reference numeral 157, which preferably includesa many-to-one mapping of PCNs to generic component supply identifiers,and a second stage mapping, designated by reference numeral 158, whichincludes a one-to-one mapping of generic component supply identifiers tocomponent supply form (CSF) parameters.

It is appreciated that for the sake of database conciseness, the secondstage mappings 155 and 158 may be combined into a single mapping.

A fifth mapping, here designated by reference numeral 159 and referredto hereinafter as CCL, maps component vendor/catalog number pairs(CV/CAT#) to generic component geometric (GCG) parameters. This mappingincludes two stages: an initial stage mapping, designated by referencenumeral 160, which includes a many-to-one mapping of componentvendor/catalog number pairs (CV/CAT#) to generic component shapeidentifiers, and a second stage mapping, designated by reference numeral162, which includes a one-to-one mapping of generic component shapeidentifiers to generic component geometric (GCG) parameters. It is notedthat the generic component geometric (GCG) parameters include, interalia, one or more default component supply forms (DCSF).

A sixth mapping, here designated by reference numeral 164 and referredto hereinafter as UMCL, maps component vendor/catalog number pairs(CV/CAT#) to generic component geometric (GCG) parameters and ismaintained by the machine line programmer using station 110 (FIG. 1).This mapping includes two stages: an initial stage mapping, designatedby reference numeral 166, which includes a many-to-one mapping ofcomponent vendor/catalog number pairs (CV/CAT#) to generic componentshape identifiers, and a second stage mapping, designated by referencenumeral 168, which includes a one-to-one mapping of generic componentshape identifiers to generic component geometric (GCG) parameters. It isnoted that the generic component geometric (GCG) parameters include,inter alia, one or more default component supply forms (DCSF).

It is appreciated that for the sake of database conciseness, the secondstage mappings 162 and 168 may be combined into a single mapping.

A seventh mapping, here designated by reference numeral 170, mapsprogrammer component numbers (PCNs) directly to generic componentgeometric (GCG) parameters. This mapping can be used by the machine lineprogrammer to override the fifth and sixth mappings.

Reference is now made to FIG. 4, which illustrates the structure andcontent of database B. As seen in FIG. 4, database B includes aplurality of mappings, each shown enclosed in a rectangle, which arepreferably employed to enhance the accessibility of the informationstored in the database.

A first mapping, here designated by reference numeral 200, mapscomponent manufacturer-independent component characteristics to rulesfor generating pick & place machine-specific component shape parameters(MSSHP). The rules for generating pick & place machine-specificcomponent shape parameters are preferably divided into several groups indatabase B including:

-   -   Rules 202 for generating component geometric parameters. These        rules are not necessarily pick & place machine-specific but        provide component geometric parameters which appear in a pick &        place machine-specific syntax.    -   Rules 204 for generating pick & place machine-specific component        handling parameters. These rules are pick & place        machine-specific.    -   Rules 206 for generating pick & place machine-specific component        imaging parameters. These rules are pick & place        machine-specific.    -   Rules 208 for generating pick & place machine-specific component        recognition tolerances. These rules are pick & place        machine-specific.    -   Rules 210 for generating pick & place machine-specific        procedures. These rules include two sub-groups of rules:        -   Rules 212 for generating component inspection procedures and            recognition standards. For example, these rules determine            the number of attempts to pick up a component before a            pick-up failure is noted.        -   Rules 214 for generating pick & place machine-specific            procedures other than rules 212 for generating component            inspection procedures and recognition standards. For            example, these rules determine what is to be done with            rejected components.

A second mapping, here designated by reference numeral 220, mapscomponent manufacturer-independent component supply form characteristicsto rules for generating pick & place machine-specific component supplyparameters (MSSUP). The rules for generating pick & placemachine-specific component supply parameters include rules 222 forgenerating component carrier type parameters. These rules are notnecessarily pick & place machine-specific but provide component carriertype parameters which appear in a pick & place machine-specific syntax.Rules 222 include four sub-groups:

-   -   Rules 224 for generating reel parameters, such as for example,        rules relating to reel diameter, width and pitch.    -   Rules 226 for generating tray parameters, such as, for example,        rules relating to the number of components contained on a tray        along its X and Y axes.    -   Rules 228 for generating stick parameters, such as, for example,        rules relating to the width of the stick and the number of        components contained in the stick.    -   Rules 230 for generating bulk parameters, such as, for example,        rules relating to the width of the opening of a bulk container.

Reference is now made to FIGS. 5A and 5B, which are exemplary chartsillustrating logical organization of rules, contained in the database ofFIG. 4, for generating pick & place machine-specific component supplyparameters and pick & place machine-specific component shape parameters,respectively.

Turning to FIG. 5A, which illustrates the organization of rules forgenerating pick & place machine-specific component supply parameters, itis seen that the chart of rules is organized along a vertical axisaccording to pick & place machine-specific component supply parameters(MSSUPs), such as reel feed pitch, reel sub-feed pitch, and reel width,to which a value is to be assigned in accordance with the rules.

-   -   It is appreciated that typically a separate chart of the type        shown in FIG. 5A is applicable to each carrier type, such as        reels, trays, sticks and bulk, and to each specific model of        pick & place machine.

Each cell in the chart contains an exemplary rule. For example, cell232, which relates to the number of machine feeds, contains a rulewhich, when operated, calculates an integer part of a ratio between thereel pitch and the machine feed distance, and assigns the resultingvalue to the machine feed parameter.

As another example, cell 234, which relates to the number of machinesub-feeds, contains a rule which, when operated, calculates theremainder of the ratio between the reel pitch and the machine feeddistance. If the remainder is not zero, the resulting value is assignedto the machine sub-feed parameter. Otherwise, the machine sub-feedparameter is irrelevant.

It is appreciated that any suitable rule logic may be employed in therules of FIG. 5A.

Turning to FIG. 5B, which illustrates the organization of rules forgenerating pick & place machine-specific component shape parameters, itis seen that the chart of rules is organized along a horizontal axisaccording to component manufacturer-independent component types, such asBGA, QFP and CONNECTORS and is organized along a vertical axis accordingto pick & place machine-specific component shape parameters (MSSHPs),such as pickup depth, named nozzle, maximum nozzle and illuminationlevel, to which a value is to be assigned in accordance with the rules.

Each cell in the chart contains an exemplary rule. For example, cell242, which relates to pickup depth for a BGA component, contains a rulewhich, when operated, defines the pickup depth to be equal to thecomponent height.

As another example, cell 244, which relates to a named nozzle for aconnector type component, contains a rule which, when operated,calculates the ratio between the maximum of the component's X dimensionand the component's Y dimension and the minimum of the component's Xdimension and the component's Y dimension, and determines the nozzle tobe used accordingly. In the example shown in cell 244, if the ratio isgreater than or equal to 2, and the minimum of the component's Xdimension and the component's Y dimension is greater than or equal to 8,then the largest nozzle is named. Otherwise, if the ratio is less than2, then the parameter of named nozzle is irrelevant. Otherwise, when theratio is greater than or equal to 2 but the minimum of the component's Xdimension and the component's Y dimension is less than 8, then a mediumnozzle is named.

As a further example, cell 246, which relates to a maximum nozzleparameter for a QFP component, contains a rule which, when operated,calculates the maximum of the component's X dimension and thecomponent's Y dimension, and determines the maximum nozzle width bymultiplying this maximum by 0.95.

It is appreciated that any suitable rule logic may be employed in therules of FIG. 5B.

Reference is now made to FIG. 6, which illustrates the structure andcontent of database C. As seen in FIG. 6, database C includes aplurality of mappings, each shown enclosed in a rectangle, which arepreferably employed to enhance the accessibility of the informationstored in the database.

A first mapping, here designated by reference numeral 250, mapsprogrammer component numbers (PCNs) to pick & place machine-specificcomponent shape identifiers. This is a many-to-one mapping.

A second mapping, here designated by reference numeral 252, maps pick &place machine-specific component shape identifiers to pick & placemachine-specific component shape parameters (MSSHP). The pick & placemachine-specific component shape parameters are divided into severalgroups in database C including:

-   -   Component geometric parameters 254. The parameters are not        necessarily pick & place machine-specific but appear in a pick &        place machine-specific syntax.    -   Pick & place machine-specific component handling parameters 256.        These parameters are pick & place machine-specific.    -   Pick & place machine-specific component imaging parameters 258.        These parameters are pick & place machine-specific.    -   Pick & place machine-specific component recognition tolerances        260. These tolerances are pick & place machine-specific.    -   Pick & place machine-specific procedures 262. These procedures        include two sub-groups:        -   Component inspection procedures and recognition standards            264.        -   Pick & place machine-specific procedures 266 other than            component inspection procedures and recognition standards            264.

A third mapping, here designated by reference numeral 268, mapsprogrammer component numbers (PCNs) to pick & place machine-specificcomponent supply identifiers. This is a many-to-one mapping.

A fourth mapping, here designated by reference numeral 270, maps pick &place machine-specific component supply identifiers to pick & placemachine-specific component supply parameters (MSSUP). The pick & placemachine-specific component supply parameters include two sub-groups:

-   -   Component carrier type parameters 272. These parameters are not        necessarily pick & place machine-specific but appear in a pick &        place machine-specific syntax. These parameters include four        further sub-groups:        -   Reel parameters 274, such as, for example, reel diameter,            width and pitch.        -   Tray parameters 276, such as, for example, the number of            components contained on a tray along its X and Y axes.        -   Stick parameters 278, such as, for example, the width of a            stick and the number of components contained in the stick.        -   Bulk parameters 280, such as, for example, the width of the            opening of a bulk container.    -   Pick & place machine-specific, component feeder-specific, feeder        advancement parameters 282. These parameters are pick & place        machine-specific.

A fifth mapping, here designated by reference numeral 284, mapsprogrammer component numbers (PCNs) to PCN parameters. These parametersare not necessarily pick & place machine-specific but appear in a pick &place machine-specific syntax. An example of a PCN parameter iscomponent polarity status.

It is noted that database C contains all of the above mappingsappropriate for each specific pick & place machine.

Reference is now made to FIG. 7, which illustrates the structure andcontent of database D. As seen in FIG. 7, database D includes aplurality of groupings of information, each shown enclosed in arectangle.

A first grouping, here designated by reference numeral 300, includesdescriptions of all possible machine configurations for each of aplurality of models of pick & place machines. This first groupingpreferably includes seven sub-groups:

-   -   Camera types and characteristics 302;    -   Illumination types and characteristics 304;    -   Component feeder carriage types and characteristics 306;    -   Component feeder types and characteristics 308;    -   Nozzle types and characteristics 310;    -   Kinetic characteristics of moving elements 312; and    -   Characteristics of moving elements 313, including, for example,        table dimensions and definition of coordinate system.

A second grouping, here designated by reference numeral 314, includesordered listings of pick & place machines in one or more machine lines.

A third grouping, here designated by reference numeral 320, includespick & place machine configurations of the pick & place machines in aplurality of machine lines. This third grouping preferably includes fivesub-groups:

-   -   Mounted camera types 322;    -   Mounted illumination types 324;    -   Mounted component feeder carriages 326;    -   Mounted component feeders 328; and    -   Mounted nozzles 330.

Reference is now made to FIGS. 8A and 8B, which together form asimplified flowchart illustrating the operation of the system andfunctionality for automated manufacture of electronic circuits of FIGS.1-7 in accordance with a preferred embodiment of the present invention.

As indicated in FIGS. 8A and 8B, and as described generally hereinabovewith reference to FIG. 1, one or more machine line programmers receiveat machine line programming station 110 (FIG. 1), preferably viacomputer network 120 (FIG. 1) from one or more remote servers 122 (FIG.1), PCA design data including CPL 124, ACVL 126 and BOM 128 data.

The machine line programmers process the received CPL 124, ACVL 126 andBOM 128 data in a conventional manner to generate CPCA data whichemploys PCN designations.

Thereafter, the machine line programmers, employing features of thepresent invention, may carry out a New PCN/CSF Search employing CCSL153, UMCSL 156 and UMCL 164. The UMCSL 156 may be manually populatedusing information from a Pre-Populated CSF Library 352 and/or may bepopulated on the fly by results of New PCN/CSF Search.

Details of the New PCN/CSF Search are now described with reference toFIG. 9. As seen in FIG. 9, the PCNs in the CPCA data which do not haveCSF parameters are selected. For each such selected PCN, a correspondingCV/CAT# is found in the MCVL 152 (FIG. 3). The CV/CAT# is then used tosearch the CCSL 153 (FIG. 3) for CSF parameters. If the CCSL search isnot successful, the CV/CAT# is then used to search the UMCL 164 (FIG. 3)for default CSF (DCSF) parameters.

If DCSF parameters are not found in the UMCL 164 for the CV/CAT#, foreach such selected PCN, PCN to GCG parameter mapping 170 (FIG. 3) isemployed to find DCSF parameters for that PCN.

If DCSF parameters for a selected PCN are not found in the UMCL 164 orby employing PCN to GCG parameter mapping 170, CSF parameters aremanually generated by the machine line programmer for that PCN. Themanually generated CSF parameters are then preferably automaticallyadded to the UMCSL 156 for the selected PCN. Preferably, the manuallygenerated CSF parameters are also preferably automatically added to theUMCL 164 as DCSF parameters for CV/CAT#s corresponding to the selectedPCN.

If one or more sets of DCSF parameters for a selected PCN are found inthe UMCL 164 or by employing PCN to GCG parameter mapping 170, thosesets of DCSF parameters, together with the corresponding selected PCN,are presented to the machine line programmer for selection of anappropriate set. If none of the sets of DCSF parameters for a selectedPCN, found in the UMCL 164 or by employing PCN to GCG parameter mapping170, are appropriate, CSF parameters are manually generated by themachine line programmer for that PCN.

If a set of DCSF parameters for a selected PCN, found in the UMCL 164 orby employing PCN to GCG parameter mapping 170, is appropriate, thoseDCSF parameters are then preferably automatically added as CSFparameters to the UMCSL 156 for the selected PCN. Preferably, the DCSFparameters are also preferably automatically added to the UMCL 164 asDCSF parameters for CV/CAT#s corresponding to the selected PCN.

At this stage, the machine line programmer has CSF parameters for eachPCN in the CPCA data. Returning now to FIGS. 8A and 8B, it is seen thatthe software of the present invention may be employed forauto-generation of pick & place machine-specific component supplyparameters (MSSUPs). The auto-generation employs UMCSL 156 and mapping220 to identify pick & place machine-specific, componentmanufacturer-independent rules for generating appropriate pick & placemachine-specific supply parameters (MSSUPs).

Details of the auto-generation are now described with reference to FIG.10, which is a simplified flowchart illustrating details ofauto-generation of pick & place machine specific component supplyparameters, and to FIGS. 11A, 11B, 11C and 11D, which are each asimplified diagrammatic illustration of the application of one type ofpick & place machine-specific component manufacturer-independent rulesfor generating a corresponding type of pick & place machine-specificcomponent supply parameters employed in accordance with a preferredembodiment of the present invention.

As seen in FIG. 10, for each pick & place machine in the manufacturingfacility 100 (FIG. 1), the PCNs in the CPCA data which do not haveMSSUPs and/or pick & place machine-specific component supply identifiersare selected.

For each such selected PCN, CSF parameters are obtained by employinggeneric component supply identifiers in the second stage mapping 158.For each such selected PCN, the CSF parameters are employed to generatea corresponding pick & place machine-specific component supplyidentifier.

The CSF parameters are employed to obtain the corresponding carrier typefor each selected PCN. The carrier type and the identification of thespecific pick & place machine for which MSSUPs are being generated areused by the software of the present invention to access an appropriaterule set, such as that appearing in FIG. 5A. Each rule in the rule setis operated based on at least one appropriate input variable formingpart of the CSF parameters to yield a value which is assigned to thecorresponding MSSUP.

FIGS. 11A-11D each illustrate the operation of an exemplary rule for adifferent respective carrier type, namely reel, tray, stick and bulk.

As seen in the example of FIG. 11A, the component is provided in a reelhaving a pitch of 8 cm, and the machine feed distance for the specificpick & place machine is 2 cm. These parameters are employed in the ruleof cell 232 to determine that the number of machine feeds requiredbetween use of components in the reel is equal to 8/2=4.

Turning now to FIG. 11B, it is seen that the component is provided in atray having 8 components along its X dimension and 16 components alongits Y dimension. These parameters are employed by a rule to convert thenumber of components along the tray X and Y dimensions to their binaryequivalents, in this case 100 and 1000 components respectively. Thebinary numbers of components along the X and Y dimensions form a part ofthe MSSUPs.

Reference is now made to FIG. 1 IC, which illustrates an example inwhich the component is provided in a stick having a width of 5 cm and isused in a machine having a slot width of 2 cm. These parameters areemployed by a rule to determine the number of slots taken up by thestick. In the present example, the rule operated checks whether there isa remainder from the division of the stick width and the slot width. Ifsuch a remainder exists, the number of slots is determined to be theratio of the stick width and the slot width, incremented by one androunded to the nearest whole number. Otherwise, the number of slots isdetermined to be the ratio between the stick width and the slot width.In the example shown in FIG. 11C, ratio between the stick width and theslot width equals 2.5, and therefore the value assigned to the MSSUPrelated to the number of slots is 3.

Turning now to FIG. 11D, it is seen that the component is provided in abulk carrier type. This parameter is employed by a rule to determine thecarrier type in pick & place machine specific language. In the presentexample, the rule checks the carrier type, and assigns an appropriatenumeral to each carrier type. As seen in the present example, as thecarrier type is bulk, the value assigned to the carrier type parameterby the rule is 4.

Returning now to FIGS. 8A and 8B, it is indicated that the machine lineprogrammers, employing features of the present invention, may carry outa New PCN/GCG Search employing CCL 159 and UMCL 164. The CCL 159 ispreferably generated from a commercially available component library357, preferably the Valor Part Library (VPL) remote server connection,which is commercially available from Valor Computerized Systems Ltd., ofYavne, Israel under catalog designator T-5000-5443. The VPL typicallyincludes a two-stage mapping, in which the first stage maps CV/CAT#s toVPL component packaging shape identifiers, and the second stage maps theVPL component shape identifiers to VPL component packaging shapeparameters.

In accordance with a preferred embodiment of the present invention, theVPL may be employed by assembly analysis, preferably by employingassembly and test analysis software commercially available from ValorComputerized Systems Ltd., of Yavne, Israel under catalog designatorT-5000-0103. The UMCL 164 may be manually populated using informationfrom a Pre-Populated GCG Library 358 and/or may be populated on the flyby results of New PCN/GCG Search.

Details of generation of the GCG parameters included in the CCL from theVPL 357 are now described with reference to FIG. 12.

As seen in FIG. 12, CV/CAT#s for which no mapping exists in the CCL areselected. For each such CV/CAT#, the software of the present inventionpreferably employs the first stage mapping of the VPL to obtain a VPLcomponent packaging shape identifier corresponding to the CV/CAT#. TheVPL component packaging shape identifier is then employed in the secondstage mapping of the VPL to obtain corresponding VPL component packagingshape parameters.

The software of the present invention preferably uses the VPL componentpackaging shape identifier and parameters to auto-generate acorresponding generic component shape identifier and GCG parameters.

The auto-generated generic component shape identifier is then used tosearch the CCL 159 for corresponding previously generated GCGparameters. If the CCL search is unsuccessful, the auto-generatedgeneric component shape identifier and corresponding GCG parameters areautomatically added to the CCL 159 for the CV/CAT#.

If previously generated GCG parameters are found in the CCL 159, theyare compared with the auto-generated GCG parameters. If discrepanciesare found, the auto-generated component shape identifier is modified toindicate that it is an additional identifier for a similar componentshape, and the modified component shape identifier and auto-generatedGCG parameters are automatically added to the CCL 159 for the CV/CAT#.

If no discrepancies are found between the previously generated GCGparameters and the auto-generated GCG parameters, the previouslygenerated component shape identifier is associated with the CV/CAT# inthe CCL 159.

Details of the New PCN/GCG Search are now described with reference toFIGS. 13A and 13B. As seen in FIGS. 13A and 13B, the PCNs in the CPCAdata which do not have GCG parameters are selected. For each suchselected PCN, a corresponding CV/CAT# is found in the MCVL 152 (FIG. 3).The CV/CAT# is then used to search the CCL 159 (FIG. 3) for GCGparameters. If GCG parameters are found, they are automatically added tothe UMCL 164 for that CV/CAT#. Additionally, the GCG parameters may beadded to the UMCL 164 for other CV/CAT#s corresponding to the selectedPCN, it being appreciated that the added GCG parameters are preferablyindicated as being added by indirect association.

If the CCL search is not successful, a proximity search is conducted by:

-   -   searching the MCVL 152 for a different PCN having at least one        CV/CAT# in common with the selected PCN; and subsequently    -   searching the MCVL 152 for a different CV/CAT# corresponding to        that different PCN that does not correspond to the selected PCN;        and subsequently    -   employing the different CV/CAT# to search the CCL 159 for        corresponding GCG parameters.

If the proximity search is successful, the GCG parameters are presentedto the machine line programmer together with the selected PCN forapproval. If approved, the GCG parameters are added to the UMCL 164 forCV/CAT#s corresponding to either of the selected PCN and the differentPCN. The GCG parameters for CV/CAT#s corresponding to the selected PCNwhich are added to the UMCL 164 are labeled to indicate that they wereobtained by means of a proximity search.

If the proximity search is unsuccessful or if the machine lineprogrammer does not approve the GCG parameters presented to him, themachine line programmer manually generates GCG parameters for theselected CV/CAT#. The manually generated GCG parameters areautomatically added to the UMCL 164 for that CV/CAT#. Additionally, theGCG parameters may be automatically added to the UMCL 164 for all otherCV/CAT#s corresponding to the selected PCN.

Returning again to FIGS. 8A and 8B, it is noted that at this stage, theprogrammer has GCG parameters for each PCN in the CPCA data. Thesoftware of the present invention may be employed for auto-generation ofpick & place machine-specific component shape parameters (MSSHPs). Theauto-generation employs UMCL 164 and mapping 200 to identify pick &place machine-specific, component manufacturer-independent rules forgenerating appropriate pick & place machine-specific shape parameters(MSSHPs).

Details of the auto-generation are now described with reference to FIG.14, which is a simplified flowchart illustrating details ofauto-generation of pick & place machine specific component shapeparameters, and to FIGS. 15A, 15B, 15C, 15D and 15E, which are each asimplified diagrammatic illustration of the application of one type ofpick & place machine-specific component manufacturer-independent rulesfor generating a corresponding type of pick & place machine-specificcomponent shape parameters employed in accordance with a preferredembodiment of the present invention.

As seen in FIG. 14, for each pick & place machine in the manufacturingfacility 100 (FIG. 1), the PCNs in the CPCA data which do not haveMSSHPs and/or pick & place machine-specific component shape identifiersare selected.

For each such selected PCN, GCG parameters are obtained by employing thegeneric component shape identifiers in the second stage mapping 168. Foreach such selected PCN, the GCG parameters are employed to generate acorresponding pick & place machine-specific component shape identifier.

The GCG parameters are employed to obtain the corresponding componenttype for each selected PCN. The component type and the identification ofthe specific pick & place machine for which MSSHPs are being generatedare used by the software of the present invention to access anappropriate rule set, such as that appearing in FIG. 5B. Each relevantrule in the rule set is operated based on at least one appropriate inputvariable forming part of the GCG parameters to yield a value which isassigned to the corresponding MSSHP.

FIGS. 15A-15E each illustrate the operation of an exemplary rule for adifferent respective rule type, namely:

-   -   Rules 202 for generating component geometric parameters;        -   Rules 204 for generating pick & place machine-specific            component handling parameters;    -   Rules 206 for generating pick & place machine-specific component        imaging parameters;    -   Rules 208 for generating pick & place machine-specific component        recognition tolerances; and    -   Rules 210 for generating pick & place machine-specific        procedures.

As seen in the example of FIG. 15A, the component is a BGA component andhas an X dimension of 1.65 cm and a Y dimension of 2.3 cm. Theseparameters are employed in rules which translate the dimensions intopick & place machine specific units, in the present example beingmillimeters. Thus, the MSSHP related to the X dimension of the componentis assigned the value 1.65*10=16.5 and the MSSHP related to the Ydimension of the component is assigned the value 2.3*10=23.

Turning now to FIG. 15B, it is seen that the component is a BGAcomponent and has an X dimension of 1.65 cm and a Y dimension of 2.3 cm.These parameters are employed in the rule of cell 246 to calculate themaximum nozzle parameter for the component. The rule is operated byfinding the maximum of the component's X dimension and the component's Ydimension, here 2.3 cm, and multiplying it by 0.95. Thus, the valueassigned to the MSSHP related to the maximum nozzle is 2.185.

Reference is now made to FIG. 15C, which illustrates an example in whichthe component is a BGA component. This parameter is employed by a ruleto determine the vision type to be used when placing the component. Therelevant rule, related to BGA, assigns vision type 135 to the MSSHPrelated to vision type for all BGA type components.

Turning now to FIG. 15D, it is seen that the component is a BGAcomponent and has an X dimension of 1.2 cm and a Y dimension of 1.3 cm.These parameters are employed by a rule to determine the X dimensiontolerance of the machine. The rule is operated by finding the minimum ofthe component's X dimension and the component's Y dimension, and thenchecking if this value is less than 1. If the value is less than 1, theX dimension tolerance is assigned to be 0.1. Otherwise, the X dimensiontolerance is assigned to be 0.1 multiplied by the minimum of the X and Ydimensions of the component. In the present example, the minimum of theX and Y dimensions of the component is 1.2, which is greater than 1, andtherefore the rule assigns to the MSSHP related to X dimension tolerancethe value 0.1*1.2=0.12.

Turning now to FIG. 15E, it is seen that the component is a QFPcomponent. This parameter is employed by a rule to determine the numberof pick-up attempts the machine should make before rejecting thecomponent. The relevant rule assigns the value 4 to this parameter ifthe component is a BGA or QFP type component, and otherwise assigns thevalue 3 to this parameter. Accordingly, the value assigned to the MSSHPrelated to the number of pick-up attempts is assigned to be 4.

Returning once again to FIGS. 8A and 8B, it is seen that line selectionis carried out using the software of the present invention by employingthe CPCA data and preferably also employing the MSSUPs and the MSSHPs.

In a case where the New PCN/CSF search and/or the New PCN/GCG searchwere not already carried out, similar searches must be carried out atthis stage.

Reference is now made to FIG. 16, which is a simplified flowchartillustrating details of alternative New PCN/CSF Search functionality,forming part of the functionality shown in the flowchart of FIGS. 8A and8B, and to FIGS. 17A and 17B, which together form a simplified flowchartillustrating details of alternative New PCN/GCG Search functionality,forming part of the functionality shown in the flowchart of FIGS. 8A and8B.

FIGS. 16 and 17A & 17B correspond generally to FIGS. 9 and 13A & 13Bdescribed hereinabove, except for the specific differences notedhereinbelow:

As distinguished from FIGS. 9 and 13A and 13B, in which the PCNs in theCPCA data which do not have CSF parameters (FIG. 9) or GCG parameters(FIG. 13A) are selected, in FIGS. 16 and 17A and 17B, selection is madeof PCNs in the CPCA data for which there are no pick & placemachine-specific supply parameters (MSSUPs), in FIG. 16, or there are nopick & place machine-specific shape parameters (MSSHPs), in FIG. 17A,for the specific pick & place machine to which the PCNs could beassigned during line balancing.

Following the searches of FIGS. 16 and 17A and 17B, auto-generation isperformed as described hereinabove with reference to FIGS. 10, 11A-11D,14 and 15A-15E.

At this stage, the machine line programmer, using conventional linebalancing software which is commercially available, inter alia, fromValor Computerized Systems Ltd. of Yavne, Israel under catalogdesignator T-5000-5215 and machine optimization software which iscommercially available, inter alia, from Valor Computerized Systems Ltd.of Yavne, Israel, inter alia under catalog designators T-5000-5570 andT-5000-5549, carries out line balancing and pick & place machineoptimization. This functionality employs the CPCA data as well as theMSSHPs and MSSUPs generated in accordance with the present invention.

The line balancing and machine optimization software provides operatinginstructions in computer-readable language to the pick & place machinesof the selected line, such as pick & place machines 102, 104 and 106(FIG. 1), and operating instructions in human-readable form to one ormore pick & place machine operators who configure the pick & placemachines in the selected line and load components onto the machines.

Reference is now made to FIG. 18, which is a simplified illustration ofa system and functionality for automated manufacture of electroniccircuits in accordance with another preferred embodiment of the presentinvention, including functionality for transferring production of anelectronic circuit from one manufacturing line to another manufacturingline.

A typical context in which the present invention is used is an automatedelectronic circuit manufacture facility which includes plural automatedelectronic circuit manufacturing lines, two of which are shown in FIG.18 and identified generally by reference numerals 500 and 501. Eachelectronic circuit manufacturing line typically comprises a plurality ofpick & place machines which may or may not originate from the sameequipment vendor. Typically, each line comprises between one and tenpick & place machines. In FIG. 18, three such machines are illustratedin line 500 and are respectively designated by reference numerals 502,503 and 504 and three such machines are illustrated in line 501 and arerespectively designated by reference numerals 506, 507 and 508. In theillustrated example of FIG. 18, pick & place machines 502, 503, 504,506, 507 and 508 are supplied by various different equipment vendors.

One or more machine line programmers, operating a machine lineprogramming station 510, are responsible, inter alia, for providingoperating instructions in computer-readable language to the pick & placemachines of one or more lines such as lines 500 and 501, such as pick &place machines 502, 503, 504, 506, 507 and 508. The machine lineprogrammer is also responsible for providing operating instructions inhuman-readable form to one or more pick & place machine operators whoconfigure the pick & place machines and load components onto themachines. These human-readable instructions may be provided to theoperators via respective displays 512, 513, 514, 516, 517 and 518 onpick & place machines 502, 503, 504, 506, 507 and 508, or preferably viahand-held terminals 520 or alternatively in hard copy.

In accordance with a preferred embodiment of the present invention, themachine line programmer employs an embodiment of the present inventionwhich is preferably embodied in software loaded onto one or morecomputers forming part of machine line programming station 510.

In the embodiment of FIG. 18, it is assumed that the machine lineprogrammer has already provided MSSUPs and MSSHPs for the production ofa given electronic circuit on one machine line, such as machine line500. The machine line programmer may now wish to transfer production ofthe electronic circuit to another line, such as machine line 501.

The machine line programmer preferably employs a database E containingcomponent manufacturer-independent, pick & place machine-specific rules,a preferred embodiment of which is illustrated in FIG. 19, as well asthe operating instructions for machine line 500, along with the MSSUPsand MSSHPs of line 500, in order to generate operating instructions formachine line 501.

Reference is now made to FIG. 19, which illustrates the structure andcontent of database E. As seen in FIG. 19, database E includes aplurality of mappings, each shown enclosed in a rectangle, which arepreferably employed to enhance the accessibility of the informationstored in the database.

A first mapping, here designated by reference numeral 530, maps pick &place machine-specific component shape parameters (MSSHP) to rules forgenerating component manufacturer-independent generic componentgeometric (GCG) parameters.

A second mapping, here designated by reference numeral 532, maps pick &place machine-specific component supply parameters (MSSUP) to rules forgenerating component manufacturer-independent generic component supplyform (CSF) parameters.

A third mapping, here designated by reference numeral 534, maps PCNs toPCN parameters.

Reference is now made to FIGS. 20A and 20B, which are simplifiedflowcharts illustrating the functionality of the system of FIGS. 18 and19, illustrating functionality for transferring component data relatingto production of an electronic circuit from one manufacturing machine toanother manufacturing machine.

As seen in FIG. 20A, PCN designations for the MSSUPs that have beengenerated for a given machine in line 500 are obtained typically fromthe computer-readable operating instructions. The UMCSL is employed tofind CSF parameters for each such PCN. Should CSF parameters not beavailable for some PCNs, the existing MSSUPs are employed toauto-generate CSF parameters.

This auto-generation preferably takes place by employing mapping 532(FIG. 19) to obtain rules for generating componentmanufacturer-independent generic component supply form (CSF) parametersand operating each rule using at least one MSSUP to obtain a value whichis assigned to at least one corresponding CSF parameter. Preferably thethus auto-generated CSF parameters are added to the UMCSL, and areindicated therein as being auto-generated.

Alternatively, the new PCN/CSF search described hereinabove withreference to FIG. 9 may be employed to obtain the CSF parameters.

The machine line programmer now has CSF parameters corresponding to eachPCN used in production of the electronic circuit in the given machine inline 500.

Employing the auto-generation functionality described hereinabove withreference to FIGS. 10 and 11A-11D, the software embodying an embodimentof the present invention automatically generates MSSUPs for each machinein a different line, such as line 501.

As seen in FIG. 20B, PCN designations for the MSSHPs that have beengenerated for a given machine in line 500 are obtained typically fromthe computer-readable operating instructions. At least one CV/CAT#corresponding to each PCN is obtained by the machine line programmer,using the MCVL. The UMCL is employed to find GCG parameters for eachsuch CV/CAT#. Should GCG parameters not be available for some PCNs, theexisting MSSHPs are employed to auto-generate GCG parameters.

This auto-generation preferably takes place by employing mapping 530(FIG. 19) to obtain rules for generating componentmanufacturer-independent generic component geometric (GCG) parametersand operating each rule using at least one MSSHP to obtain a value whichis assigned to at least one corresponding GCG parameter. Preferably, thethus auto-generated GCG parameters are added to mapping 170.

Alternatively, the new PCN/GCG search described hereinabove withreference to FIG. 13 may be employed to obtain the GCG parameters.

The machine line programmer now has GCG parameters corresponding to eachPCN used in production of the electronic circuit in the given machine inline 500.

Employing the auto-generation functionality described hereinabove withreference to FIGS. 14 and 15A-15E, the software embodying an embodimentof the present invention automatically generates MSSHPs for each machinein a different line, such as line 501.

Machine balancing, as described hereinabove with reference to FIGS. 8Aand 8B, may now be carried out for line 501.

Reference is now made to FIG. 21, which is a simplified illustration ofa system and functionality for automated manufacture of electroniccircuits in accordance with another preferred embodiment of the presentinvention, including functionality for modifying operating instructionswhen a substitute component, having at least one differentcharacteristic, is sought to be employed on a manufacturing line.

A typical context in which the present invention is used is an automatedelectronic circuit manufacture facility which includes one or moreautomated electronic circuit manufacturing lines, one of which is shownin FIG. 21 and identified generally by reference numeral 600. Eachelectronic circuit manufacturing line typically comprises a plurality ofpick & place machines which may or may not originate from the sameequipment vendor. Typically, each line comprises between one and tenpick & place machines. In FIG. 21, three such machines are illustratedin line 600 and are respectively designated by reference numerals 602,603 and 604.

One or more machine line programmers, operating a machine lineprogramming station 610, are responsible, inter alia, for providingoperating instructions in computer-readable language to the pick & placemachines of one or more lines such as line 600, such as pick & placemachines 602, 603 and 604. The machine line programmer is alsoresponsible for providing operating instructions in human-readable formto one or more pick & place machine operators who configure the pick &place machines and load components onto the machines. Thesehuman-readable instructions may be provided to the operators viarespective displays 612, 613 and 614, on pick & place machines 602, 603and 604, or, preferably, via hand-held terminals 620 or alternatively inhard copy.

In accordance with a preferred embodiment of the present invention, themachine line programmer employs an embodiment of the present inventionwhich is preferably embodied in software loaded onto one or morecomputers forming part of station 610.

In the embodiment of FIG. 21, it is assumed that the machine lineprogrammer has already provided MSSUPs and MSSHPs for the production ofa given electronic circuit on a machine line, such as machine line 600.It is necessary, sometimes at very short notice, to substitute one ofthe components used in production of the electronic circuit, such ascomponent 620, by another component having at least one differentcharacteristic, such as component 622. The machine line programmerwishes to adapt the operating instructions without, insofar as possible,interrupting production by the machine line.

The software in station 610, which embodies an embodiment of the presentinvention, preferably, automatically compares the GCG parameters of thesubstitute component with those associated with the original componentand auto-generates appropriate new MSSHPs which are employed in updatedoperating instructions. Preferably, this can be done within a matter ofseconds, i.e. effectively in real time.

Reference is now made to FIG. 22, which is a simplified flowchartillustrating the functionality of the system of FIG. 21, illustratingfunctionality for modifying operating instructions when a substitutecomponent, having at least one different characteristic, is sought to beemployed on a manufacturing line.

As seen in FIG. 22, the UMCL is employed to find GCG parameters for theoriginal component and the substitute component by using the respectiveCV/CAT#s thereof. If GCG parameters for the substitute component are notfound, the new PCN/GCG search functionality described hereinabove withreference to FIGS. 17A and 17B is employed to obtain GCG parameters forthe substitute component.

The GCG parameters of the original component and of the substitutecomponent are automatically compared. If a discrepancy is found, themappings 250 and 252 (FIG. 6) are employed to find MSSHPs correspondingto the substitute component. If such MSSHPs are found, the operatinginstructions are updated accordingly. Otherwise, the MSSHPauto-generation functionality described hereinabove with reference toFIGS. 14 and 15A-15E is employed to automatically generate MSSHPs forthe substitute component. The operating instructions are updatedaccordingly.

Reference is now made to FIG. 23, which is a simplified illustration ofa system and functionality for automated manufacture of electroniccircuits in accordance with still another preferred embodiment of thepresent invention, including functionality for auto-generation ofAMSSHPs and AMSSUPs having enhanced generality. It is appreciated thatthe AMSSHPs and the AMSSUPs may be applicable for multipleconfigurations of a pick & place machine and for multiple models of apick & place machine.

The embodiment of FIG. 23 and of FIGS. 24-34, which are describedhereinbelow, relate to the auto-generation of adaptive parameters, whichare parameters which are independent of pick & place machineconfiguration and may be variable as a function of specific pick & placemachine configuration, which is determined only upon line balancing. Byemploying adaptive parameters, as in the embodiment of FIGS. 23-34, therules set which is used to generate these parameters can be reduced andthe number of such parameters can be reduced correspondingly.Accordingly the numbers of AMSSHPs and AMSSUPs for a given productproduction can be substantially less than the corresponding number ofMSSHPs and MSSUPs required in accordance with the embodiment of FIGS.1-17.

A typical context in which the present invention is used is an automatedelectronic circuit manufacture facility which includes one or moreautomated electronic circuit manufacturing lines, one of which is shownin FIG. 23 and identified generally by reference numeral 700. Eachelectronic circuit manufacturing line typically comprises a plurality ofpick & place machines which may or may not originate from the sameequipment vendor. Typically, each line comprises between one and tenpick & place machines. In FIG. 23, three such machines are illustratedin line 700 and are respectively designated by reference numerals 702,703 and 704.

One or more machine line programmers, operating a machine lineprogramming station 710, are responsible, inter alia, for providingoperating instructions in computer-readable language to the pick & placemachines of one or more lines such as line 700, such as pick & placemachines 702, 703 and 704. The machine line programmer is alsoresponsible for providing operating instructions in human-readable formto one or more pick & place machine operators who configure the pick &place machines and load components onto the machines. Thesehuman-readable instructions may be provided to the operators viarespective displays 712, 713 and 714, on pick & place machines 702, 703and 704, or, preferably, via hand-held terminals 718 or, alternatively,in hard copy.

In the embodiment of FIG. 23, as distinguished from that of FIG. 1,adaptive MSSUPs and MSSHPs are provided for the production of a givenelectronic circuit on a machine line, such as machine line 700, and maybe suitable for more than a single configuration of a pick & placemachine.

In accordance with a preferred embodiment of the present invention, themachine line programmer employs an embodiment of the present inventionwhich is preferably embodied in software loaded onto one or morecomputers forming part of machine line programming station 710. Themachine line programmer also employs electronic circuit design andspecification data specific to each electronic circuit to bemanufactured. This data is preferably supplied via a computer network720 from one or more remote servers 722, directly to one or morecomputers forming part of machine line programming station 710 andpreferably includes CPL, ACVL and BOM data, respectively designated byreference numerals 724, 726 and 728.

In processing the received CPL 724, ACVL 726 and BOM 728 data to provideoperating instructions, the machine line programmer preferably employsdatabases 730 preferably including at least four databases, identifiedin FIG. 23 as databases A, B, C and D. As indicated in FIG. 24, to whichreference is now additionally made, databases A, B, C and D may becharacterized as follows:

Database A—containing pick & place machine vendor-independent componentand supply data;

Database B—containing rules for generating adaptive pick & placemachine-specific, component manufacturer-independent data;

Database C—containing adaptive pick & place machine-specific componentand supply data; and

Database D—containing pick & place line and machine configurations.

FIG. 24 diagrammatically illustrates that in accordance with a preferredembodiment of the present invention databases A, B and D are employed incombination in accordance with the present invention to auto-generate atleast part of the content of database C. It is appreciated thatdatabases A and D shown in FIGS. 23 and 24 are typically similar todatabases A and D described hereinabove with reference to FIGS. 1 and 2,and that databases B and C are similar to databases B and C describedhereinabove with reference to FIGS. 1 and 2, but include modificationsas described hereinbelow with reference to FIGS. 25-27.

As seen in FIG. 23, preferably the machine line programming station 710,using software of the present invention, employs the received CPL 724,ACVL 726 and BOM 728 data and databases A, B and possibly D to performauto-generation of adaptive pick & place machine-specific componentshape parameters and adaptive pick & place machine-specific componentsupply parameters which are preferably incorporated into database C, asdescribed hereinbelow.

As also seen in FIG. 23, the machine line programming station 710, usingsoftware of the present invention, preferably employs the received CPL724, ACVL 726 and BOM 728 data and databases A-D to perform linebalancing and programming functions, the outputs of which are pick &place machine-specific component shape and supply parameters which aresupplied to pick & place machines 702, 703 and 704 in a machine-readablelanguage which is readable by each specific machine and human-readablemachine feeder set-up instructions specifically adapted for each of thepick & place machines 702, 703 and 704.

Reference is now made to FIG. 25, which illustrates the structure andcontent of database B. As seen in FIG. 25, database B includes aplurality of mappings, each shown enclosed in a rectangle, which arepreferably employed to enhance the accessibility of the informationstored in the database.

A first mapping, here designated by reference numeral 740, mapscomponent manufacturer-independent component characteristics to rulesfor generating adaptive pick & place machine-specific component shapeparameters (AMSSHP). The rules for generating adaptive pick & placemachine-specific component shape parameters are preferably divided intoseveral groups in database B including:

-   -   Rules 742 for generating component geometric parameters. These        rules are not necessarily pick & place machine-specific but        provide component geometric parameters which appear in a pick &        place machine-specific syntax.    -   Rules 744 for generating adaptive pick & place machine-specific        component handling parameters. These rules are pick & place        machine-specific.    -   Rules 746 for generating adaptive pick & place machine-specific        component imaging parameters. These rules are pick & place        machine-specific.    -   Rules 748 for generating adaptive pick & place machine-specific        component recognition tolerances. These rules are pick & place        machine-specific.    -   Rules 750 for generating pick & place machine-specific        procedures. These rules include two sub-groups of rules:        -   Rules 752 for generating component inspection procedures and            recognition standards. For example, these rules determine            the number of attempts to pick up a component before a            pick-up failure is noted.        -   Rules 754 for generating pick & place machine-specific            procedures other than rules 752 for generating component            inspection procedures and recognition standards. For            example, these rules determine what is to be done with            rejected components.

A second mapping, here designated by reference numeral 760, mapscomponent manufacturer-independent component supply form characteristicsto rules for generating adaptive pick & place machine-specific componentsupply parameters (AMSSUP). The rules for generating adaptive pick &place machine-specific component supply parameters include rules 762 forgenerating adaptive component carrier type parameters. These rules arenot necessarily pick & place machine-specific but provide adaptivecomponent carrier type parameters which appear in a pick & placemachine-specific syntax. Rules 762 include four sub-groups:

-   -   Rules 764 for generating adaptive reel parameters, such as for        example, rules relating to reel diameter, width and pitch.    -   Rules 766 for generating adaptive tray parameters, such as, for        example, rules relating to the number of components contained on        a tray along its X and Y axes.    -   Rules 768 for generating adaptive stick parameters, such as, for        example, rules relating to the width of the stick and the number        of components contained in the stick.    -   Rules 770 for generating adaptive bulk parameters, such as, for        example, rules relating to the width of the opening of a bulk        container.

Reference is now made to FIGS. 26A and 26B, which are exemplary chartsillustrating logical organization of rules, contained in the database ofFIG. 25, for generating adaptive pick & place machine-specific componentshape parameters and adaptive component supply parameters, respectively.

Turning to FIG. 26A, which illustrates the organization of rules forgenerating adaptive pick & place machine-specific component supplyparameters, it is seen that the chart of rules is organized along avertical axis according to adaptive pick & place machine-specificcomponent supply parameters (AMSSUPs), such as feeder name, to which avalue is to be assigned in accordance with the rules.

It is appreciated that typically a separate chart of the type shown inFIG. 26A is applicable to each carrier type, such as reels, trays,sticks and bulk, and to each specific model of pick & place machine.

Each cell in the chart contains an exemplary rule. For example, cell772, which relates to feeder name, contains a rule that, when operated,determines that if a front tray lifter is used then the feeder name isA, and otherwise the feeder name is B.

It is appreciated that any suitable rule logic may be employed in therules of FIG. 26A.

Turning to FIG. 26B, which illustrates the organization of rules forgenerating adaptive pick & place machine-specific component shapeparameters, it is seen that the chart of rules is organized along ahorizontal axis according to component manufacturer-independentcomponent types, such as BGA, QFP and CONNECTORS and is organized alonga vertical axis according to adaptive pick & place machine-specificcomponent shape parameters (AMSSHPs), such as pickup depth, pickup speedand illumination level, to which a value is to be assigned in accordancewith the rules.

Each cell in the chart contains an exemplary rule. For example, cell782, which relates to a suitable vision algorithm for a BGA component,contains a rule which, when operated, checks the number of leads of thecomponent, and defines the vision algorithm to be used accordingly. Inthe example shown in cell 782, if the number of leads is greater than100, it is not relevant to use a machine configured to haveback-lighting, otherwise, in a machine configured to have back-lighting,algorithm 105 should be used, and in a machine configured to havefront-lighting algorithm 103 should be used.

As another example, cell 784, which relates to a suitable visionalgorithm for a QFP component, contains a rule which, when operated,defines that a vision algorithm is not relevant when the machine isconfigured to have back-lighting, and that vision algorithm 107 shouldbe used when the machine is configured to have front-lighting.

As a further example, cell 786, which relates to a suitable visionalgorithm for a connector type component, contains a rule which, whenoperated, checks the component pitch, and defines the vision algorithmto be used accordingly. In the example shown in cell 786, if the pitchis less than 0.01, it is not relevant to use a machine configured tohave back-lighting and in a machine configured to have front-lightingvision algorithm 120 should be used. Otherwise, in a machine configuredto have back-lighting, algorithm 150 should be used, and in a machineconfigured to have front-lighting algorithm 130 should be used.

It is appreciated that any suitable rule logic may be employed in therules of FIG. 26B.

Reference is now made to FIG. 27, which illustrates the structure andcontent of database C. As seen in FIG. 27, database C includes aplurality of mappings, each shown enclosed in a rectangle, which arepreferably employed to enhance the accessibility of the informationstored in the database.

A first mapping, here designated by reference numeral 790, mapsprogrammer component numbers (PCNs) to pick & place machine-specificcomponent shape identifiers. This is a many-to-one mapping.

A second mapping, here designated by reference numeral 792, maps pick &place machine-specific component shape identifiers to adaptive pick &place machine-specific component shape parameters (AMSSHP). The adaptivepick & place machine-specific component shape parameters are dividedinto several groups in database C including:

-   -   Component geometric parameters 794. The parameters are not        necessarily pick & place machine-specific but appear in a pick &        place machine-specific syntax.    -   Adaptive pick & place machine-specific component handling        parameters 796. These parameters are pick & place        machine-specific.    -   Adaptive pick & place machine-specific component imaging        parameters 798. These parameters are pick & place        machine-specific.    -   Adaptive pick & place machine-specific component recognition        tolerances 800. These tolerances are pick & place        machine-specific.    -   Pick & place machine-specific procedures 802. These procedures        include two sub-groups:        -   Component inspection procedures and recognition standards            804.        -   Pick & place machine-specific procedures 806 other than            component inspection procedures and recognition standards            804.

A third mapping, here designated by reference numeral 808, mapsprogrammer component numbers (PCNs) to pick & place machine-specificcomponent supply identifiers. This is a many-to-one mapping.

A fourth mapping, here designated by reference numeral 810, maps pick &place machine-specific component supply identifiers to adaptive pick &place machine-specific component supply parameters (AMSSUP). Theadaptive pick & place machine-specific component supply parametersinclude two sub-groups:

-   -   Adaptive component carrier type parameters 812. These parameters        are not necessarily pick & place machine-specific but appear in        a pick & place machine-specific syntax. These parameters include        four further sub-groups:        -   Adaptive reel parameters 814, such as, for example, reel            diameter, width and pitch.        -   Adaptive tray parameters 816, such as, for example, the            number of components contained on a tray along its X and Y            axes.        -   Adaptive stick parameters 818, such as, for example, the            width of a stick and the number of components contained in            the stick.        -   Adaptive bulk parameters 820, such as, for example, the            width of the opening of a bulk container.    -   Pick & place machine-specific, component feeder-specific, feeder        advancement parameters 822. These parameters are pick & place        machine-specific.

A fifth mapping, here designated by reference numeral 824, mapsprogrammer component numbers (PCNs) to PCN parameters. These parametersare not necessarily pick & place machine-specific but appear in a pick &place machine-specific syntax. An example of a PCN parameter iscomponent polarity status.

It is noted that database C contains all of the above mappingsappropriate for each specific pick & place machine.

Reference is now made to FIGS. 28A and 28B, which together form asimplified flowchart illustrating the operation of the system andfunctionality for automated manufacture of electronic circuits of FIGS.23-27 in accordance with a preferred embodiment of the presentinvention.

As indicated in FIGS. 28A and 28B, and as described generallyhereinabove with reference to FIG. 23, one or more machine lineprogrammers receive at machine line programming station 710 (FIG. 23),preferably via computer network 720 (FIG. 23) from one or more remoteservers 722 (FIG. 23), PCA design data including CPL 724, ACVL 726 andBOM 728 data.

The machine line programmers process the received CPL 724, ACVL 726 andBOM 728 data in a conventional manner to generate CPCA data whichemploys PCN designations.

Thereafter, the machine line programmers, employing features of thepresent invention, may carry out a New PCN/CSF Search employing CCSL153, UMCSL 156 and UMCL 164. The UMCSL 156 may be manually populatedusing information from a Pre-Populated CSF Library 828 and/or may bepopulated on the fly by results of New PCN/CSF Search.

Details of the New PCN/CSF Search may be identical to those describedhereinabove with reference to FIG. 9.

At this stage, the machine line programmer has CSF parameters for eachPCN in the CPCA data. It is seen that the software of the presentinvention may be employed for auto-generation of adaptive pick & placemachine-specific component supply parameters (AMSSUPs). Theauto-generation employs UMCSL 156 and mapping 760 to identify pick &place machine-specific, component manufacturer-independent rules forgenerating appropriate adaptive pick & place machine-specific supplyparameters (AMSSUPs).

Details of the auto-generation are now described with reference to FIG.29, which is a simplified flowchart illustrating details ofauto-generation of adaptive pick & place machine specific componentsupply parameters, and to FIG. 30, which is a simplified diagrammaticillustration of the application of pick & place machine-specificcomponent manufacturer-independent rules for generating adaptive pick &place machine-specific component supply parameters for a specificcarrier type employed in accordance with a preferred embodiment of thepresent invention.

As seen in FIG. 29, for each pick & place machine in the manufacturingfacility 700 (FIG. 23), the PCNs in the CPCA data which do not haveAMSSUPs and/or pick & place machine-specific component supplyidentifiers are selected.

For each such selected PCN, CSF parameters are obtained by employinggeneric component supply identifiers in the second stage mapping 158(FIG. 3). For each such selected PCN, the CSF parameters are employed togenerate a corresponding pick & place machine-specific component supplyidentifier.

The CSF parameters are employed to obtain the corresponding carrier typefor each selected PCN. The carrier type and the identification of thespecific pick & place machine for which AMSSUPs are being generated areused by the software of the present invention to access an appropriaterule set, such as that appearing in FIG. 26A. Each rule in the rule setis operated based on at least one appropriate input variable formingpart of the CSF parameters to yield a plurality of values which areassigned to the corresponding AMSSUP for various corresponding machineconfigurations.

FIG. 30 illustrates the operation of an exemplary rule for a traycarrier type. In the example in FIG. 30, the generic component supplyform parameter for the specific component is a tray lifter. Thisparameter is employed in the rule of cell 772 to determined that theparameter is a tray lifter, and provides an adaptive pick & placemachine specific component supply parameter related to the tray lifter.

Returning now to FIGS. 28A and 28B, it is indicated that the machineline programmers, employing features of the present invention, may carryout a New PCN/GCG Search employing CCL 159 and UMCL 164. The UMCL 164may be manually populated using information from a Pre-Populated GCGLibrary 830 and/or may be populated on the fly by results of New PCN/GCGSearch.

Details of the New PCN/GCG Search may be identical to those describedhereinabove with reference to FIGS. 13A and 13B.

It is noted that at this stage, the programmer has GCG parameters foreach PCN in the CPCA data. The software of the present invention may beemployed for auto-generation of adaptive pick & place machine-specificcomponent shape parameters (AMSSHPs). The auto-generation employs UMCL164 and mapping 740 to identify pick & place machine-specific, componentmanufacturer-independent rules for generating appropriate adaptive pick& place machine-specific shape parameters (AMSSHPs).

Details of the auto-generation are now described with reference to FIG.31, which is a simplified flowchart illustrating details ofauto-generation of adaptive pick & place machine specific componentshape parameters, and to FIG. 32 which is a simplified diagrammaticillustration of the application of pick & place machine-specificcomponent manufacturer-independent rules for generating pick & placemachine-specific component handling parameters employed in accordancewith a preferred embodiment of the present invention.

As seen in FIG. 31, for each pick & place machine in the manufacturingfacility 700 (FIG. 23), the PCNs in the CPCA data which do not haveAMSSHPs and/or pick & place machine-specific component shape identifiersare selected.

For each such selected PCN, GCG parameters are obtained by employing thegeneric component shape identifiers in the second stage mapping 168. Foreach such selected PCN, the GCG parameters are employed to generate acorresponding pick & place machine-specific component shape identifier.

The GCG parameters are employed to obtain the corresponding componenttype for each selected PCN. The component type and the identification ofthe specific pick & place machine for which AMSSHPs are being generatedare used by the software of the present invention to access anappropriate rule set, such as that appearing in FIG. 26A. Each relevantrule in the rule set is operated based on at least one appropriate inputvariable forming part of the GCG parameters to yield a plurality ofvalues which are assigned to the corresponding AMSSHP for variouscorresponding machine configurations.

FIG. 32 illustrates the operation of an exemplary rule for a componenthandling parameter. In the example in FIG. 32, the component is of typeBGA, where the component has 38 leads. These parameters are employed toobtain an appropriate rule and to operate the rule. In this case, therule in cell 782 is operated, by comparing the number of leads to 100.Since the number of leads is less than 100, the vision algorithm isassigned to be algorithm 105 when the machine is configured to haveback-lighting and algorithm 103 when the machine is configured to havefront lighting.

Returning once again to FIGS. 28A and 28B, it is seen that lineselection is carried out using the software of the present invention byemploying the CPCA data and preferably also employing the AMSSUPs andthe AMSSHPs.

In a case where the New PCN/CSF search and/or the New PCN/GCG searchwere not already carried out, similar searches must be carried out atthis stage. It is appreciated that the New PCN/CSF search and the NewPCN/GCG search may be identical to respective searches describedhereinabove with reference to FIGS. 16, 17A and 17B.

Following these searches, auto-generation is performed as describedhereinabove with reference to FIGS. 29-32.

At this stage, the machine line programmer, using conventional linebalancing software which is commercially available, inter alia, fromValor Computerized Systems Ltd. of Yavne, Israel under catalogdesignator T-5000-5215 and machine optimization software which iscommercially available, inter alia, from Valor Computerized Systems Ltd.of Yavne, Israel, inter alia under catalog designators T-5000-5570 andT-5000-5549, carries out line balancing and pick & place machineoptimization. This functionality employs the CPCA data as well as theAMSSHPs and AMSSUPs generated in accordance with the present invention.

In accordance with a preferred embodiment of the present invention,following line balancing and thus once the precise pick & place machineconfigurations are known, suitable variables in each AMSSHP and AMSSUPare selected accordingly, thus providing suitable corresponding MSSHPsand MSSUPs for these specific configurations.

The line balancing and machine optimization software provides operatinginstructions in computer-readable language to the pick & place machinesof the selected line, such as pick & place machines 702, 704 and 706(FIG. 23), and operating instructions in human-readable form to one ormore pick & place machine operators who configure the pick & placemachines in the selected line and load components onto the machines.

FIGS. 33 and 34 are simplified diagrammatic illustrations of thespecification of the adaptive pick & place machine-specific componentsupply parameters for a reel carrier type and the adaptive pick & placemachine-specific component handling parameters shown in respective FIGS.30 and 32.

As seen in FIG. 33, AMSSUPs 850 for a specific component, shown ascomponent 156SN444, and for a specific pick & place machine, shown asmachine 123M4, in combination with the machine configuration, areemployed in providing suitable MSSUPs 852 for the same component andmachine. The machine configuration, here including a front tray lifter,is employed in the adaptive parameter related to feeder name as providedin the AMSSUP 850, and the feeder name is selected to be 100.

Turning now to FIG. 34, it is seen that AMSSHPs 860 for a specificcomponent, shown as component 156SN444, and for a specific pick & placemachine, shown as machine 123M4, in combination with the machineconfiguration, are employed in providing suitable MSSHPs 862 for thesame component and machine. The machine configuration, here includingback-lighting, is employed in the adaptive parameter related to visionalgorithm provided in the AMSSHP 860, and the vision algorithm isselected to be 105.

Reference is now made to FIG. 35, which is a simplified illustration ofa system and functionality for automated manufacture of electroniccircuits in accordance with a further preferred embodiment of thepresent invention, including functionality for employing newlyauto-generated pick & place machine-specific component supply parametersand pick & place machine-specific component shape parameters instead ofearlier generated pick & place machine-specific component supplyparameters and pick & place machine-specific component shape parameters.

A typical context in which an embodiment of the present invention isused is an automated electronic circuit manufacture facility whichincludes one or more automated electronic circuit manufacturing lines,one of which is shown in FIG. 35 and identified generally by referencenumeral 900. Each electronic circuit manufacturing line typicallycomprises a plurality of pick & place machines which may or may notoriginate from the same equipment vendor. Typically, each line comprisesbetween one and ten pick & place machines. In FIG. 35, three suchmachines are illustrated in line 900 and are respectively designated byreference numerals 902, 903 and 904.

One or more machine line programmers, operating a machine lineprogramming station 910, are responsible, inter alia, for providingoperating instructions in computer-readable language to the pick & placemachines of one or more lines such as line 900, such as pick & placemachines 902, 903 and 904. The machine line programmer is alsoresponsible for providing operating instructions in human-readable formto one or more pick & place machine operators who configure the pick &place machines and load components onto the machines. Thesehuman-readable instructions may be provided to the operators viarespective displays 912, 913 and 914 on pick & place machines 902, 903and 904 or preferably via hand-held terminals 920 or alternatively inhard copy.

In accordance with a preferred embodiment of the present invention, themachine line programmer employs an embodiment of the present inventionwhich is preferably embodied in software loaded onto one or morecomputers forming part of machine line programming station 910.

In the embodiment of FIG. 35, it is assumed that MSSUPs and MSSHPs forthe production of an electronic circuit on a machine line, such asmachine line 900, have already been generated. In the course ofemploying an embodiment of the present invention, new MSSUPs and MSSHPsare auto-generated. The new MSSUPs and MSSHPs are often more up-to-datethan the earlier generated MSSUPs and MSSHPs and may be more closelycompatible with the embodiment of the present invention which is used inthe auto-generation thereof and overall may be considered to beoptimized to the pick & place machine line. Accordingly, it is aparticular feature of the present invention that the new MSSUPs andMSSHPs are employed to override the earlier generated MSSUPs and MSSHPsin database C. Preferably this override functionality takes place in thebackground and does not interfere with production.

In accordance with this embodiment of the present invention, thesoftware in machine line programming station 910 is operative to performauto-generation of MSSUPs and MSSHPs not only in cases where suitableMSSUPs and MSSHPs do not exist, but also in cases where existing MSSUPsand MSSHPs were not auto-generated by software including an embodimentof the present invention. The functionality employed in the embodimentof FIG. 35 may be similar to that described hereinabove with referenceto FIGS. 8A and 8B and is distinguished therefrom as describedhereinbelow with reference to FIGS. 36 and 37, which correspond to andare distinguished from respective FIGS. 10 and 14.

Reference is now made to FIG. 36, which is a simplified flowchartillustrating details of auto-generation of pick & place machine specificcomponent supply parameters forming part of the functionality of FIG.35.

As seen in FIG. 10, for each pick & place machine in the manufacturingfacility 100 (FIG. 1), the PCNs in the CPCA data which do not haveMSSUPs and/or Pick & place machine-specific component supply identifiersare selected. In the embodiment of FIG. 36, as distinct from FIG. 10,for each pick & place machine in the manufacturing facility 900 (FIG.35), the PCNs in the CPCA data which do not have MSSUPs auto-generatedby software incorporating an embodiment of the present invention and/orpick & place machine-specific component supply identifiers are selected.

For each such selected PCN, CSF parameters are obtained by employinggeneric component supply identifiers in the second stage mapping 158(FIG. 3). For each such selected PCN, the CSF parameters are employed togenerate a corresponding pick & place machine-specific component supplyidentifier.

The CSF parameters are employed to obtain the corresponding carrier typefor each selected PCN. The carrier type and the identification of thespecific pick & place machine for which MSSUPs are being generated areused by the software of the present invention to access an appropriaterule set, such as that appearing in FIG. 5A. Each rule in the rule setis operated based on at least one appropriate input variable formingpart of the CSF parameters to yield a value which is assigned to thecorresponding MSSUP.

Reference is now made to FIG. 37, which is a simplified flowchartillustrating details of auto-generation of pick & place machine specificcomponent shape parameters forming part of the functionality of FIG. 35.

As seen in FIG. 14, for each pick & place machine in the manufacturingfacility 100 (FIG. 1), the PCNs in the CPCA data which do not haveMSSHPs and/or Pick & place machine-specific component shape identifiersare selected. In the embodiment of FIG. 37, as distinct from FIG. 14,for each pick & place machine in the manufacturing facility 900 (FIG.35), the PCNs in the CPCA data which do not have MSSHPs auto-generatedby software incorporating an embodiment of the present invention and/orpick & place machine-specific component shape identifiers are selected.

For each such selected PCN, GCG parameters are obtained by employing thegeneric component shape identifiers in the second stage mapping 168(FIG. 3). For each such selected PCN, the GCG parameters are employed togenerate a corresponding pick & place machine-specific component shapeidentifier.

The GCG parameters are employed to obtain the corresponding componenttype for each selected PCN. The component type and the identification ofthe specific pick & place machine for which MSSHPs are being generatedare used by the software of the present invention to access anappropriate rule set, such as that appearing in FIG. 5A. Each relevantrule in the rule set is operated based on at least one appropriate inputvariable forming part of the GCG parameters to yield a value which isassigned to the corresponding MSSHP.

It is appreciated by persons skilled in the art that the presentinvention is not limited by what has been particularly shown anddescribed hereinabove. Rather the scope of the present inventionincludes both combinations and subcombinations of various featuresdescribed hereinabove as well as variations and modifications theretowhich would occur to a person of skill in the art upon reading the abovedescription and which are not in the prior art.

1. A method of manufacturing electronic circuits comprising: generatingCAD data, a bill of materials and an approved component vendor list foran electronic circuit; and employing said CAD data, said bill ofmaterials and said approved component vendor list for automaticallygenerating: a pick & place machine-specific component loadingspecification; a pick & place machine-specific component placementsequence; and pick & place machine-specific component data for governingthe operation of at least one specific pick & place machine in amanufacturing line.
 2. A method of manufacturing electronic circuitsaccording to claim 1 and wherein said employing said CAD data, said billof materials and said approved component vendor list for automaticallygenerating pick & place machine specific component data for governingthe operation of at least one specific pick & place machine includes:automatically generating said pick & place machine-specific componentdata by employing a first database containing at least one of pick &place machine-independent, geometric component data and pick & placemachine-independent, component supply data and a second databasecontaining machine-specific, component manufacturer-independent rulesfor generating said pick & place machine-specific component data.
 3. Amethod of manufacturing electronic circuits according to claim 1 andwherein said pick & place machine specific component data for governingthe operation of at least one specific pick & place machine comprises atleast one of pick & place machine-specific component shape parametersand pick & place machine-specific component supply parameters.
 4. Amethod of manufacturing electronic circuits according to claim 1 andwherein said automatically generating pick & place machine-specificcomponent data comprises automatically generating a third databasecontaining at least: a mapping between component identifiers and pick &place machine-specific component shape parameters; and a mapping betweensaid component identifiers and pick & place machine-specific componentsupply parameters.
 5. A method of manufacturing electronic circuitsaccording to claim 4 and wherein said mapping between componentidentifiers and pick & place machine-specific component shape parameterscomprises: a mapping of PCNs to component shape identifiers; and amapping of component shape identifiers to pick & place machine-specificcomponent shape parameters.
 6. A method of manufacturing electroniccircuits according to claim 5 and wherein said component shapeidentifiers are pick & place machine-specific component shapeidentifiers.
 7. A method of manufacturing electronic circuits accordingto claim 4 and wherein said mapping between said component identifiersand pick & place machine-specific component supply parameters comprises:a mapping of PCNs to component supply identifiers; and a mapping ofcomponent supply identifiers to pick & place machine-specific componentsupply parameters.
 8. A method of manufacturing electronic circuitsaccording to claim 7 and wherein said component supply identifiers arepick & place machine-specific component supply identifiers.
 9. A methodof manufacturing electronic circuits according to claim 4 and whereinsaid pick & place machine-specific component shape parameters include atleast one of: component geometry parameters; component handlingparameters; component imaging parameters; component recognitiontolerances; and pick & place machine-specific procedures.
 10. A methodof manufacturing electronic circuits according to claim 4 and whereinsaid pick & place machine-specific component shape parameters include atleast one of: component geometry parameters in pick & placemachine-specific syntax; pick & place machine-specific componenthandling parameters; pick & place machine-specific component imagingparameters; pick & place machine-specific component recognitiontolerances; and pick & place machine-specific procedures.
 11. A methodof manufacturing electronic circuits according to claim 4 and whereinsaid pick & place machine-specific component supply parameters includeat least one of: a component carrier type; and pick & placemachine-specific, component carrier-specific parameters.
 12. A method ofmanufacturing electronic circuits according to claim 1 and wherein atleast part of said pick & place machine-specific component datacomprises adaptive pick & place machine-specific component data.
 13. Amethod of manufacturing electronic circuits according to claim 12 andwherein said adaptive pick & place machine specific component datacomprises adaptive pick & place machine specific component shape data.14. A method of manufacturing electronic circuits according to claim 12and wherein said adaptive pick & place machine specific component datacomprises adaptive pick & place machine specific component supply data.15. A method of manufacturing electronic circuits according to claim 2and wherein said first database comprises at least one of: a mapping ofCV/Cat#s to component vendor-specific component geometric parameters(CCL); a mapping of CV/Cat#s to component supply form parameters (CCSL);a mapping of PCNs to component supply form parameters (UMCSL); a mappingof PCNs to CV/Cat#s (MCVL); a mapping of DCN to PCN; a user maintainedmapping of CV/Cat# to component vendor-specific component geometricparameters (UMCL); and a mapping of PCN to generic component geometricparameters.
 16. A method of manufacturing electronic circuits accordingto claim 2 and wherein said second database comprises at least one of: amapping of component manufacturer-independent component characteristicsto rules for generating pick & place machine-specific component shapeparameters; and a mapping of component manufacturer-independentcomponent supply form characteristics to rules for generating pick &place machine-specific component supply parameters.
 17. A method ofmanufacturing electronic circuits according to claim 16 and wherein saidrules for generating pick & place machine-specific component shapeparameters include rules for generating at least one of: componentgeometric parameters in pick & place machine specific syntax; pick &place machine specific component handling parameters; pick & placemachine specific component imaging parameters; pick & place machinespecific component recognition tolerances; and pick & place machinespecific procedures.
 18. A method of manufacturing electronic circuitsaccording to claim 16 and wherein said rules for generating pick & placemachine-specific component supply parameters include rules forgenerating at least one of: a component carrier type in pick & placemachine-specific syntax; and component carrier type-specific parametersin pick & place machine-specific syntax.
 19. A method of manufacturingelectronic circuits according to claim 16 and wherein said seconddatabase comprises at least one of: a mapping of componentmanufacturer-independent component characteristics to rules forgenerating adaptive pick & place machine-specific component shapeparameters; and a mapping of component manufacturer-independentcomponent supply form characteristics to rules for generating adaptivepick & place machine-specific component supply parameters.
 20. A methodof manufacturing electronic circuits according to claim 19 and whereinsaid rules for generating adaptive pick & place machine-specificcomponent shape parameters include rules for generating at least one of:component geometric parameters in pick & place machine specific syntax;adaptive pick & place machine specific component handling parameters;adaptive pick & place machine specific component imaging parameters;adaptive pick & place machine specific component recognition tolerances;and pick & place machine specific procedures.
 21. A method ofmanufacturing electronic circuits according to claim 19 and wherein saidrules for generating adaptive pick & place machine-specific componentsupply parameters include rules for generating at least one of: adaptivecomponent carrier type in pick & place machine-specific syntax; andadaptive component carrier type-specific parameters in pick & placemachine-specific syntax.
 22. A method of manufacturing electroniccircuits according to claim 1 and wherein said second database isoperator modifiable.
 23. A method of manufacturing electronic circuitsaccording to claim 1 and wherein said employing said CAD data, said billof materials and said approved component vendor list for automaticallygenerating pick & place machine specific component data for governingthe operation of at least one specific pick & place machine includes:automatically generating said pick & place machine-specific componentdata by employing a fourth database containing pick & place line andmachine configurations.
 24. A method of manufacturing electroniccircuits according to claim 23 and wherein said fourth databasecomprises at least one of: pick & place machine configurations; orderedlistings of pick & place machines in at least one machine line; and pick& place machine configurations of said pick & place machines in said atleast one machine line.
 25. A method of manufacturing electroniccircuits according to claim 24 and wherein said pick & place machineconfigurations include at least one of: camera types andcharacteristics; illumination types and characteristics; componentfeeder carriage types and characteristics; component feeder types andcharacteristics; nozzle types and characteristics; and kineticcharacteristics of moving elements.
 26. A method of manufacturingelectronic circuits according to claim 24 and wherein said pick & placemachine configurations of said pick & place machines in said pluralityof machine lines include at least one of: mounted camera types; mountedillumination types; mounted component feeder carriages; mountedcomponent feeders; and mounted nozzles.
 27. A method of manufacturingelectronic circuits according to claim 2 and wherein said employing saidCAD data, said bill of materials and said approved component vendor listfor automatically generating pick & place machine-specific componentloading specification, pick & place machine-specific component placementsequence and pick & place machine-specific component data for governingthe operation of at least one specific pick & place machine in amanufacturing line comprises: employing said CAD data, said bill ofmaterials, said approved component vendor list and said first databaseto search for component data for new components; and employing saidfirst database and said second database to auto-generate said pick &place machine specific component data.
 28. A method of manufacturingelectronic circuits according to claim 27 and wherein said employingsaid CAD data, said bill of materials and said approved component vendorlist for automatically generating pick & place machine-specificcomponent loading specification, pick & place machine-specific componentplacement sequence and pick & place machine-specific component data forgoverning the operation of at least one specific pick & place machine ina manufacturing line also comprises: prior to said employing said CADdata said bill of materials, said approved component vendor list andsaid first database to search for component data for new components,employing said CAD data, said bill of materials and said approvedcomponent vendor list to form combined printed circuit assembly data;following said employing said first database and said second database,selecting a pick & place machine line; thereafter, employing saidcombined printed circuit assembly data together with said pick & placemachine specific component data to balance said pick & place machineline; and thereafter, employing a computer to provide said pick & placemachine-specific component loading specification, said pick & placemachine-specific component placement sequence and said pick & placemachine-specific component data for governing the operation of at leastone specific pick & place machine in a manufacturing line to at leastone pick & place machine in said pick & place machine line.
 29. A methodof manufacturing electronic circuits according to claim 28, and whereinsaid combined printed circuit assembly data employs PCN designations.30. A method of manufacturing electronic circuits according to claim 28and wherein said employing said CAD data, said bill of materials, saidapproved component vendor list and said first database to search forcomponent data for new components comprises employing said combinedprinted circuit assembly data and said first database to search for saidcomponent data for new components.
 31. A method of manufacturingelectronic circuits according to claim 30 and wherein said employingsaid combined printed circuit assembly data and said first database tosearch for component data for new components comprises: searching saidfirst database for pick & place machine independent component supplydata for said new components; and searching said first database for pick& place machine independent geometric component data for said newcomponents.
 32. A method of manufacturing electronic circuits accordingto claim 31 and wherein said searching said first database for pick &place machine independent component supply data for said new componentscomprises: selecting at least one PCN corresponding to ones of said newcomponents for which CSF parameters are not available; obtaining aCV/CAT# corresponding to said at least one PCN corresponding to ones ofsaid new components for which CSF parameters are not available; andemploying said CV/CAT# to search at least part of said first databasefor corresponding CSF parameters.
 33. A method of manufacturingelectronic circuits according to claim 32 and also comprising employingsaid CV/CAT# to search at least part of said first database forcorresponding default CSF parameters.
 34. A method of manufacturingelectronic circuits according to claim 32 and also comprising employingsaid at least one PCN to search at least part of said first database forat least one corresponding set of default CSF parameters.
 35. A methodof manufacturing electronic circuits according to claim 32 and alsocomprising: presenting said at least one corresponding set of defaultCSF parameters and said at least one PCN to an operator for selection ofan appropriate set of CSF parameters.
 36. A method of manufacturingelectronic circuits according to claim 35 and also comprising, followingsaid presenting: automatically adding said appropriate set of CSFparameters as CSF parameters to said first database for said at leastone PCN; and automatically adding said appropriate set of CSF parametersas default CSF parameters to said first database for CV/CAT#scorresponding to said at least one PCN.
 37. A method of manufacturingelectronic circuits according to claim 32 and also comprising: providingmanually generated CSF parameters for said at least one PCN;automatically adding said manually generated CSF parameters to saidfirst database for said at least one PCN; and automatically adding saidmanually generated CSF parameters as default CSF parameters to saidfirst database for CV/CAT#s corresponding to said at least one PCN. 38.A method of manufacturing electronic circuits according to claim 32 andwherein said selecting at least one PCN corresponding to ones of saidnew components for which CSF parameters are not available comprisesselecting at least one PCN in said combined printed circuit assemblydata which does not have CSF parameters.
 39. A method of manufacturingelectronic circuits according to claim 32 and wherein said selecting atleast one PCN corresponding to ones of said new components for which CSFparameters are not available comprises selecting at least one PCN insaid combined printed circuit assembly data for which there are no pick& place machine specific component supply parameters.
 40. A method ofmanufacturing electronic circuits according to claim 31 and wherein saidsearching said first database for pick & place machine independentcomponent supply data for said new components comprises: selecting atleast one PCN corresponding to ones of said new components for which GCGparameters are not available; obtaining a CV/CAT# corresponding to saidat least one PCN corresponding to ones of said new components for whichGCG parameters are not available; and employing said CV/CAT# to searchat least part of said first database for corresponding GCG parameters.41. A method of manufacturing electronic circuits according to claim 40and wherein said employing said CV/CAT# also comprises: automaticallyadding said corresponding GCG parameters to said first database for saidCV/CAT#; and automatically adding said corresponding GCG parameters tosaid first database for other CV/CAT#s corresponding to said at leastone PCN corresponding to ones of said new components for which GCGparameters are not available.
 42. A method of manufacturing electroniccircuits according to claim 40 and also comprising, following saidemploying said CV/CAT#, conducting a proximity search including:searching said first database for at least one additional PCN having atleast one corresponding CV/CAT#, which is different from said CV/CAT#,in common with said at least one PCN corresponding to ones of said newcomponents for which GCG parameters are not available; searching saidfirst database for at least one different CV/CAT# corresponding to saidat least one additional PCN, which does not correspond to said at leastone PCN corresponding to ones of said new components for which GCGparameters are not available; and employing said at least one differentCV/CAT# to search at least part of said first database for GCGparameters corresponding to said at least one different CV/CAT#.
 43. Amethod of manufacturing electronic circuits according to claim 42 andalso comprising: presenting said GCG parameters corresponding to said atleast one different CV/CAT# and said at least one PCN corresponding toones of said new components for which GCG parameters are not availableto an operator for approval.
 44. A method of manufacturing electroniccircuits according to claim 43 and also comprising: automatically addingsaid GCG parameters corresponding to said at least one different CV/CAT#to said first database as GCG parameters corresponding to CV/CAT#scorresponding to at least one of said at least one PCN corresponding toones of said new components for which GCG parameters are not availableand said at least one additional PCN; and automatically indicating, forall CV/CAT#s corresponding to said at least one PCN corresponding toones of said new components for which GCG parameters are not available,said GCG parameters as being obtained by said proximity search.
 45. Amethod of manufacturing electronic circuits according to claim 40 andalso comprising: providing manually generated GCG parameters for saidCV/CAT#; automatically adding said manually generated GCG parameters tosaid first database for said CV/CAT#; and automatically adding saidmanually generated GCG parameters to said first database for CV/CAT#scorresponding to said at least one PCN corresponding to ones of said newcomponents for which GCG parameters are not available.
 46. A method ofmanufacturing electronic circuits according to claim 40 and wherein saidselecting at least one PCN corresponding to ones of said new componentsfor which GCG parameters are not available comprises selecting at leastone PCN in said combined printed circuit assembly data which does nothave GCG parameters.
 47. A method of manufacturing electronic circuitsaccording to claim 40 and wherein said selecting at least one PCNcorresponding to ones of said new components for which GCG parametersare not available comprises selecting at least one PCN in said combinedprinted circuit assembly data for which there are no pick & placemachine specific component shape parameters.
 48. A method ofmanufacturing electronic circuits according to claim 28 and wherein saidemploying said first database and said second database to auto-generatesaid pick & place machine specific component data comprises: employingsaid pick & place machine independent component supply data and saidmachine-specific, component manufacturer-independent rules forgenerating said pick & place machine-specific component data toauto-generate pick & place machine specific component supply parameters;and employing said pick & place machine independent geometric componentdata and said machine-specific, component manufacturer-independent rulesfor generating said pick & place machine-specific component data toauto-generate pick & place machine specific component shape parameters.49. A method of manufacturing electronic circuits according to claim 48and wherein said employing said pick & place machine independentcomponent supply data comprises: for a specific pick & place machine insaid pick & place machine line, selecting at least one PCN in saidcombined printed circuit assembly data for which at least one ofcorresponding pick & place machine specific component supply parametersand a corresponding pick & place machine specific component supplyidentifier is not available; employing at least one generic componentsupply identifier to obtain CSF parameters corresponding to said atleast one PCN in said combined printed circuit assembly data for whichat least one of corresponding pick & place machine specific componentsupply parameters and a corresponding pick & place machine specificcomponent supply identifier is not available; employing at least part ofsaid CSF parameters to access appropriate ones of said machine-specific,component manufacturer-independent rules for generating said pick &place machine-specific component data; operating said appropriate onesof said machine-specific, component manufacturer-independent rules forgenerating said pick & place machine-specific component data based on atleast one of said CSF parameters to yield corresponding values; andassigning said corresponding values to corresponding ones of said pick &place machine-specific component supply parameters.
 50. A method ofmanufacturing electronic circuits according to claim 49 and alsocomprising, prior to said employing at least part of said CSF parametersto access appropriate ones of said machine-specific, componentmanufacturer-independent rules, employing at least part of said CSFparameters to auto-generate said corresponding pick & place machinespecific component supply identifier.
 51. A method of manufacturingelectronic circuits according to claim 48 and wherein said employingsaid pick & place machine independent geometric component datacomprises: for a specific pick & place machine in said pick & placemachine line, selecting at least one PCN in said combined printedcircuit assembly data for which at least one of corresponding pick &place machine specific component shape parameters and a correspondingpick & place machine specific component shape identifier is notavailable; employing at least one generic component shape identifier toobtain GCG parameters corresponding to said at least one PCN in saidcombined printed circuit assembly data for which at least one ofcorresponding pick & place machine specific component shape parametersand a corresponding pick & place machine specific component shapeidentifier is not available; employing at least part of said GCGparameters to access appropriate ones of said machine-specific,component manufacturer-independent rules for generating said pick &place machine-specific component data; operating said appropriate onesof said machine-specific, component manufacturer-independent rules forgenerating said pick & place machine-specific component data based on atleast one of said GCG parameters to yield corresponding values; andassigning said corresponding values to corresponding ones of said pick &place machine-specific component shape parameters.
 52. A method ofmanufacturing electronic circuits according to claim 51 and alsocomprising, prior to said employing at least part of said GCG parametersto access appropriate ones of said machine-specific, componentmanufacturer-independent rules, employing at least part of said GCGparameters to auto-generate said corresponding pick & place machinespecific component shape identifier.
 53. A method of manufacturingelectronic circuits according to claim 27 and also comprising, prior tosaid employing said CAD data, said bill of materials, said approvedcomponent vendor list and said first database, automatically populatinga CCL portion of said first database.
 54. A method of manufacturingelectronic circuits according to claim 53 and wherein said automaticallypopulating comprises employing a component library which maps CV/CAT#sto component packaging shape parameters.
 55. A method of manufacturingelectronic circuits according to claim 54 and wherein said employing acomponent library comprises employing said component library whichincludes: a first stage mapping which maps CV/CAT#s to componentpackaging shape identifiers; and a second stage mapping which maps saidcomponent packaging shape identifiers to component packaging shapeparameters.
 56. A method of manufacturing electronic circuits accordingto claim 55 and wherein said automatically populating comprises:obtaining at least one CV/CAT# for which no mapping exists in said CCLportion; employing said first stage mapping to obtain a componentpackaging shape identifier corresponding to said at least one CV/CAT#;employing said second stage mapping to obtain component packaging shapeparameters corresponding to said component packaging shape identifiercorresponding to said at least one CV/CAT#; employing said componentpackaging shape identifier corresponding to said at least one CV/CAT#;and said component packaging shape parameters corresponding to saidcomponent packaging shape identifier to provide an auto-generatedgeneric component shape identifier and auto-generated GCG parameters;and adding said auto-generated generic component shape identifier andsaid auto-generated GCG parameters to said CCL portion for said at leastone CV/CAT#.
 57. A method of manufacturing electronic circuits accordingto claim 56 and wherein said automatically populating also comprises,prior to said adding: employing said auto-generated generic componentshape identifier to search said CCL portion for corresponding,previously generated GCG parameters; comparing said previously generatedGCG parameters and said auto-generated GCG parameters; and ifdiscrepancies are found, modifying said auto-generated generic componentshape identifier to provide a modified generic component shapeidentifier and adding said modified generic component shape identifierand said auto-generated GCG parameters to said CCL portion for said atleast one CV/CAT#.
 58. A method of manufacturing electronic circuitsaccording to claim 28 and also comprising, following said employing saidcombined printed circuit assembly data together with said pick & placemachine specific component data to balance said pick & place machineline, assigning suitable variables to adaptive ones of said pick & placemachine specific component data to provide pick & place machine specificcomponent data which corresponds to a specific pick & place machineconfiguration for at least one pick & place machine in said pick & placemachine line.
 59. A method of manufacturing electronic circuitsaccording to claim 1 and wherein said employing said CAD data, said billof materials and said approved component vendor list for automaticallygenerating does not require operator entry of pick & placemachine-specific component data. 60-87. (canceled)
 88. Apparatus formanufacturing electronic circuits comprising: a computerized electroniccircuit data generator operative for generating CAD data, a bill ofmaterials and an approved component vendor list for an electroniccircuit; and a computerized generator operative for employing said CADdata, said bill of materials and said approved component vendor list forautomatically generating: a pick & place machine-specific componentloading specification; a pick & place machine-specific componentplacement sequence; and pick & place machine-specific component data forgoverning the operation of at least one specific pick & place machine ina manufacturing line.
 89. Apparatus for manufacturing electroniccircuits according to claim 88 and wherein said computerized generatorincludes: a first database containing at least one of pick & placemachine-independent, geometric component data and pick & placemachine-independent, component supply data; and a second databasecontaining machine-specific, component manufacturer-independent rulesfor generating said pick & place machine-specific component data. 90.Apparatus for manufacturing electronic circuits according to either ofclaim 88 and 89 and wherein said pick & place machine specific componentdata for governing the operation of at least one specific pick & placemachine comprises at least one of pick & place machine-specificcomponent shape parameters and pick & place machine-specific componentsupply parameters.
 91. Apparatus for manufacturing electronic circuitsaccording to claim 88 and wherein said computerized generator is alsooperative for automatically generating a third database containing atleast: a mapping between component identifiers and pick & placemachine-specific component shape parameters; and a mapping between saidcomponent identifiers and pick & place machine-specific component supplyparameters.
 92. Apparatus for manufacturing electronic circuitsaccording to claim 91 and wherein said mapping between componentidentifiers and pick & place machine-specific component shape parameterscomprises: a mapping of PCNs to component shape identifiers; and amapping of component shape identifiers to pick & place machine-specificcomponent shape parameters.
 93. Apparatus for manufacturing electroniccircuits according to claim 92 and wherein said component shapeidentifiers are pick & place machine-specific component shapeidentifiers.
 94. Apparatus for manufacturing electronic circuitsaccording to claim 91 and wherein said mapping between said componentidentifiers and pick & place machine-specific component supplyparameters comprises: a mapping of PCNs to component supply identifiers;and a mapping of component supply identifiers to pick & placemachine-specific component supply parameters.
 95. Apparatus formanufacturing electronic circuits according to claim 94 and wherein saidcomponent supply identifiers are pick & place machine-specific componentsupply identifiers.
 96. Apparatus for manufacturing electronic circuitsto any of claim 91 and wherein said pick & place machine-specificcomponent shape parameters include at least one of: component geometryparameters; component handling parameters; component imaging parameters;component recognition tolerances; and pick & place machine-specificprocedures.
 97. Apparatus for manufacturing electronic circuitsaccording to claim 91 and wherein said pick & place machine-specificcomponent shape parameters include at least one of: component geometryparameters in pick & place machine-specific syntax; pick & placemachine-specific component handling parameters; pick & placemachine-specific component imaging parameters; pick & placemachine-specific component recognition tolerances; and pick & placemachine-specific procedures.
 98. Apparatus for manufacturing electroniccircuits according to claim 91 and wherein said pick & placemachine-specific component supply parameters include at least one of: acomponent carrier type; and pick & place machine-specific, componentcarrier-specific parameters.
 99. Apparatus for manufacturing electroniccircuits according to claim 88 and wherein at least part of said pick &place machine-specific component data comprises adaptive pick & placemachine-specific component data.
 100. Apparatus for manufacturingelectronic circuits according to claim 99 and wherein said adaptive pick& place machine specific component data comprises adaptive pick & placemachine specific component shape data.
 101. Apparatus for manufacturingelectronic circuits according to claim 99 and wherein said adaptive pick& place machine specific component data comprises adaptive pick & placemachine specific component supply data.
 102. Apparatus for manufacturingelectronic circuits according to claim 89 and wherein said firstdatabase comprises at least one of: a mapping of CV/Cat#s to componentvendor-specific component geometric parameters (CCL); a mapping ofCV/Cat#s to component supply form parameters (CCSL); a mapping of PCNsto component supply form parameters (UMCSL); a mapping of PCNs toCV/Cat#s (MCVL); a mapping of DCN to PCN; a user maintained mapping ofCV/Cat# to component vendor-specific component geometric parameters(UMCL); and a mapping of PCN to generic component geometric parameters.103. Apparatus for manufacturing electronic circuits according to claim89 and wherein said second database comprises at least one of: a mappingof component manufacturer-independent component characteristics to rulesfor generating pick & place machine-specific component shape parameters;and a mapping of component manufacturer-independent component supplyform characteristics to rules for generating pick & placemachine-specific component supply parameters.
 104. Apparatus formanufacturing electronic circuits according to claim 103 and whereinsaid rules for generating pick & place machine-specific component shapeparameters include rules for generating at least one of: componentgeometric parameters in pick & place machine specific syntax; pick &place machine specific component handling parameters; pick & placemachine specific component imaging parameters; pick & place machinespecific component recognition tolerances; and pick & place machinespecific procedures.
 105. Apparatus for manufacturing electroniccircuits according to claim 103 and wherein said rules for generatingpick & place machine-specific component supply parameters include rulesfor generating at least one of: a component carrier type in pick & placemachine-specific syntax; and component carrier type-specific parametersin pick & place machine-specific syntax.
 106. Apparatus formanufacturing electronic circuits according to claim 103 and whereinsaid second database comprises at least one of: a mapping of componentmanufacturer-independent component characteristics to rules forgenerating adaptive pick & place machine-specific component shapeparameters; and a mapping of component manufacturer-independentcomponent supply form characteristics to rules for generating adaptivepick & place machine-specific component supply parameters. 107.Apparatus for manufacturing electronic circuits according to claim 106and wherein said rules for generating adaptive pick & placemachine-specific component shape parameters include rules for generatingat least one of: component geometric parameters in pick & place machinespecific syntax; adaptive pick & place machine specific componenthandling parameters; adaptive pick & place machine specific componentimaging parameters; adaptive pick & place machine specific componentrecognition tolerances; and pick & place machine specific procedures.108. Apparatus for manufacturing electronic circuits according to claim106 and wherein said rules for generating adaptive pick & placemachine-specific component supply parameters include rules forgenerating at least one of: adaptive component carrier type in pick &place machine-specific syntax; and adaptive component carriertype-specific parameters in pick & place machine-specific syntax. 109.Apparatus for manufacturing electronic circuits according to claim 103and wherein said second database is operator modifiable.
 110. Apparatusfor manufacturing electronic circuits according to claim 88 and whereinsaid computerized generator includes: a fourth database containing pick& place line and machine configurations.
 111. Apparatus formanufacturing electronic circuits according to claim 110 and whereinsaid fourth database comprises at least one of: pick & place machineconfigurations; ordered listings of pick & place machines in a pluralityof machine lines; and pick & place machine configurations of said pick &place machines in said plurality of machine lines.
 112. Apparatus formanufacturing electronic circuits according to claim 111 and whereinsaid pick & place machine configurations include at least one of: cameratypes and characteristics; illumination types and characteristics;component feeder carriage types and characteristics; component feedertypes and characteristics; nozzle types and characteristics; and kineticcharacteristics of moving elements.
 113. Apparatus for manufacturingelectronic circuits according to either of claim 111 and wherein saidpick & place machine configurations of said pick & place machines insaid plurality of machine lines include at least one of: mounted cameratypes; mounted illumination types; mounted component feeder carriages;mounted component feeders; and mounted nozzles.
 114. Apparatus formanufacturing electronic circuits according to claim 89 and wherein saidcomputerized generator comprises: computerized new component datasearching functionality operative to employ said CAD data, said bill ofmaterials, said approved component vendor list and said first databaseto search for component data for new components; and computerizedauto-generation functionality operative to employ said first databaseand said second database to auto-generate said pick & place machinespecific component data.
 115. Apparatus for manufacturing electroniccircuits according to claim 114 and wherein said computerized generatoralso comprises: a computerized combined printed circuit assembly datagenerator operative to employ said CAD data, said bill of materials andsaid approved component vendor list to form combined printed circuitassembly data; a computerized line selector operative to select a pick &place machine line; computerized line balancing functionality operativeto employ said combined printed circuit assembly data together with saidpick & place machine specific component data to balance said pick &place machine line.
 116. A method of manufacturing electronic circuitsaccording to claim 115, and wherein said combined printed circuitassembly data employs PCN designations.
 117. Apparatus for manufacturingelectronic circuits according to claim 114 and wherein said computerizednew component data searching functionality comprises: computerizedcomponent supply data searching functionality operative to search saidfirst database for pick & place machine independent component supplydata for said new components; and computerized component shape datasearching functionality operative to search said first database for pick& place machine independent geometric component data for said newcomponents.
 118. Apparatus for manufacturing electronic circuitsaccording to claim 117 and wherein said computerized component supplydata searching functionality comprises: a PCN selector operative toselect at least one PCN corresponding to ones of said new components forwhich CSF parameters are not available; CSF CV/CAT# obtainingfunctionality operative to obtain a CV/CAT# corresponding to said atleast one PCN corresponding to ones of said new components for which CSFparameters are not available; and CSF searching functionality operativeto employ said CV/CAT# to search at least part of said first databasefor corresponding CSF parameters.
 119. Apparatus for manufacturingelectronic circuits according to claim 117 and wherein said computerizedcomponent shape data searching functionality comprises: a PCN selectoroperative to select at least one PCN corresponding to ones of said newcomponents for which GCG parameters are not available; GCG CV/CAT#obtaining functionality operative to obtain a CV/CAT# corresponding tosaid at least one PCN corresponding to ones of said new components forwhich GCG parameters are not available; and GCG searching functionalityoperative to employ said CV/CAT# to search at least part of said firstdatabase for corresponding GCG parameters.
 120. Apparatus formanufacturing electronic circuits according to claim 119 and whereinsaid computerized component shape data searching functionality alsocomprises computerized proximity searching functionality, including:first computerized searching functionality operative to search saidfirst database for at least one additional PCN having at least onecorresponding CV/CAT#, which is different from said CV/CAT#, in commonwith said at least one PCN corresponding to ones of said new componentsfor which GCG parameters are not available; second computerizedsearching functionality operative to search said first database for atleast one different CV/CAT# corresponding to said at least oneadditional PCN, which does not correspond to said at least one PCNcorresponding to ones of said new components for which GCG parametersare not available; and proximate GCG parameter searching functionalityoperative to employ said at least one different CV/CAT# to search atleast part of said first database for GCG parameters corresponding tosaid at least one different CV/CAT#.
 121. Apparatus for manufacturingelectronic circuits according to claim 114 and wherein said computerizedauto-generation functionality comprises: component supply parameterauto-generation functionality operative to employ said first databaseand said second database to auto-generate pick & place machine specificcomponent supply parameters; and component shape parameterauto-generation functionality operative to employ said first databaseand said second database to auto-generate pick & place machine specificcomponent shape parameters.
 122. Apparatus for manufacturing electroniccircuits according to claim 121 and wherein said component supplyparameter auto-generation functionality comprises: a PCN selectoroperative, for a specific pick & place machine in said pick & placemachine line, to select at least one PCN in said combined printedcircuit assembly data for which at least one of corresponding pick &place machine specific component supply parameters and a correspondingpick & place machine specific component supply identifier is notavailable; CSF parameter obtaining functionality operative to employ atleast one generic component supply identifier to obtain CSF parameterscorresponding to said at least one PCN in said combined printed circuitassembly data for which at least one of corresponding pick & placemachine specific component supply parameters and a corresponding pick &place machine specific component supply identifier is not available;rules operating functionality operative to employ at least part of saidCSF parameters to access appropriate ones of said machine-specific,component manufacturer-independent rules for generating said pick &place machine-specific component data and to operate said appropriateones of said machine-specific, component manufacturer-independent rulesfor generating said pick & place machine-specific component data basedon at least one of said CSF parameters to yield corresponding values;and value assigning functionality operative to assign said correspondingvalues to corresponding ones of said pick & place machine-specificcomponent supply parameters.
 123. Apparatus for manufacturing electroniccircuits according to claim 122 and wherein said component supplyparameter auto-generation functionality also comprises component supplyidentifier auto-generation functionality operative to employ at leastpart of said CSF parameters to auto-generate said corresponding pick &place machine specific component supply identifier.
 124. Apparatus formanufacturing electronic circuits according to claim 121 and whereinsaid component shape parameter auto-generation functionality comprises:a PCN selector operative, for a specific pick & place machine in saidpick & place machine line, to select at least one PCN in said combinedprinted circuit assembly data for which at least one of correspondingpick & place machine specific component shape parameters and acorresponding pick & place machine specific component shape identifieris not available; GCG parameter obtaining functionality operative toemploy at least one generic component shape identifier to obtain GCGparameters corresponding to said at least one PCN in said combinedprinted circuit assembly data for which at least one of correspondingpick & place machine specific component shape parameters and acorresponding pick & place machine specific component shape identifieris not available; rules operating functionality operative to employ atleast part of said GCG parameters to access appropriate ones of saidmachine-specific, component manufacturer-independent rules forgenerating said pick & place machine-specific component data and tooperate said appropriate ones of said machine-specific, componentmanufacturer-independent rules for generating said pick & placemachine-specific component data based on at least one of said GCGparameters to yield corresponding values; and value assigningfunctionality operative to assign said corresponding values tocorresponding ones of said pick & place machine-specific component shapeparameters.
 125. Apparatus for manufacturing electronic circuitsaccording to claim 124 and wherein said component shape parameterauto-generation functionality also comprises component shape identifierauto-generation functionality operative to employ at least part of saidGCG parameters to auto-generate said corresponding pick & place machinespecific component shape identifier.
 126. Apparatus for manufacturingelectronic circuits according to claim 114 and also comprising acomputerized database populating functionality operative toautomatically populate a CCL portion of said first database. 127.Apparatus for manufacturing electronic circuits according to claim 126and wherein said computerized database populating functionality alsocomprises component library which maps CV/CAT#s to component packagingshape parameters.
 128. Apparatus for manufacturing electronic circuitsaccording to claim 127 and wherein said component library comprises: afirst stage mapping which maps CV/CAT#s to component packaging shapeidentifiers; and a second stage mapping which maps said componentpackaging shape identifiers to component packaging shape parameters.129. Apparatus for manufacturing electronic circuits according to claim128 and wherein said computerized database populating functionalitycomprises: CV/CAT# obtaining functionality operative to obtain at leastone CV/CAT# for which no mapping exists in said CCL portion; componentpackaging shape identifier obtaining functionality operative to employsaid first stage mapping to obtain a component packaging shapeidentifier corresponding to said at least one CV/CAT#; and componentpackaging shape parameter obtaining functionality operative to employsaid second stage mapping to obtain component packaging shape parameterscorresponding to said component packaging shape identifier correspondingto said at least one CV/CAT#.
 130. Apparatus for manufacturingelectronic circuits according to claim 114 and also comprising valueassigning functionality operative to assign suitable variables toadaptive ones of said pick & place machine specific component data toprovide pick & place machine specific component data which correspondsto a specific pick & place machine configuration for at least one pick &place machine in said pick & place machine line. 131-149. (canceled)